Inventor
Mitsuya Ohie
Inventor
Kanagawa, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use21%
G01RMeasuring electric variables18%
H03MCoding5%
G11CStatic stores3%
H03KPulse technique3%
H04LTransmission of digital information, e.g. telegraphic communication3%
PatentTitleYear
8,745,420'Semiconductor device for supplying power supply voltage to semiconductor device'20148,407,491'Semiconductor device for supplying power supply voltage to semiconductor device'20137,761,727'Micro-controller having USB control unit, MC unit and oscillating circuit commonly used by the USB control unit and the MC unit'20107,664,969'Semiconductor device for supplying external power supply voltages to three circuit blocks including USB controller and I/O block'20107,414,320'Semiconductor device and method of manufacturing same'20087,409,573'Micro-controller having USB control unit, MC unit and oscillating circuit commonly used by the USB control unit and the MC unit'20086,971,032'Supplying multiple voltages via three power supply terminals to a semiconductor device that is connectable to a host device and a peripheral device'20056,967,397'Test circuit and multi-chip package type semiconductor device having the test circuit'20056,938,108'Micro-controller having USB control unit, MC unit and oscillating circuit commonly used by the USB control unit and the MC unit'20056,905,913'Semiconductor device and method of manufacturing same'20056,897,554'Test circuit and multi-chip package type semiconductor device having the test circuit'20056,885,095'Test circuit and multi-chip package type semiconductor device having the test circuit'20056,885,094'Test circuit and multi-chip package type semiconductor device having the test circuit'20056,777,801'Semiconductor device and method of manufacturing same'20046,762,486'Test circuit and multi-chip package type semiconductor device having the test circuit'20046,580,164'Semiconductor device and method of manufacturing same'20036,445,700'Serial communication circuit'20026,249,152'Data storage control circuit'20016,229,369'Clock control circuit'20015,936,448'Integrated circuit having independently testable input-output circuits and test method therefor'19995,815,105'Analog-to-digital converter with writable result register'19985,581,556'Local area network system'19965,481,214'Voltage to pulse-width conversion circuit'19965,451,952'CMOS flash analog-to-digital converter with hysteresis'19955,410,269'Sample-and-hold circuit'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2008Patents assigned to OKI ELECTRIC IND CO LTD (21)· patent assignee history
1995–2002Based in Tokyo, JP· patent location history
2003–2014Based in Kanagawa, JP· patent location history
2010–2013Patents assigned to OKI SEMICONDUCTOR CO LTD (3)· patent assignee history
2013Patents assigned to HASHIDATE SHUICHI (1)· patent assignee history
2013Patents assigned to NAKAMURA KYOTARO (1)· patent assignee history
2014Patents assigned to LAPIS SEMICONDUCTOR CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| OKI ELECTRIC IND CO LTD | 21 | 1995–2008 |
| OKI SEMICONDUCTOR CO LTD | 3 | 2010–2013 |
| HASHIDATE SHUICHI | 1 | 2013 |
| LAPIS SEMICONDUCTOR CO LTD | 1 | 2014 |
| NAKAMURA KYOTARO | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 16 | 2003–2014 |
| Tokyo, JP | 9 | 1995–2002 |