Inventor
Takuo KISAKI
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H03Hprimary
H03HImpedance networks, e.g. resonant circuits27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01LSemiconductor devices20%
H05KPrinted circuits20%
H03BGeneration of oscillations, directly or by frequency-changing, by circuits employing active elements which operate in a non-switching manner7%
PatentTitleYear
11,923,288Wiring substrate, electronic device, and electronic module each having plate-shaped conductive portion in frame portion of insulation substrate202411,515,242Wiring substrate, electronic device, and electronic module each having plate-shaped conductive portion in frame portion of insulation substrate202211,394,362Electronic component housing package, electronic apparatus, and electronic module202211,388,819Wiring board, electronic device, and electronic module2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to KYOCERA CORP (4)· patent assignee history
2022–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KYOCERA CORP | 4 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2024 |