Inventor
Michael Juerss
Inventor
Regenstauf, DE
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10DInorganic electric semiconductor devices13%
H05KPrinted circuits7%
PatentTitleYear
10,964,628Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture202110,886,186Semiconductor package system202110,475,761Method for producing electronic device with multi-layer contact201910,043,782Electronic device package having a dielectric layer and an encapsulant20189,953,952Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier20189,490,193'Electronic device with multi-layer contact'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to INFINEON TECHNOLOGIES AG (6)· patent assignee history
2016–2018Patents assigned to JUERSS MICHAEL (2)· patent assignee history
2016Patents assigned to EICHINGER OLIVER (1)· patent assignee history
2016Patents assigned to GOH KOK CHAI (1)· patent assignee history
2016Patents assigned to HEINRICH ALEXANDER (1)· patent assignee history
2016–2019Based in Regenstauf, DE· patent location history
2021Based in Regensburg, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 6 | 2016–2021 |
| JUERSS MICHAELself | 2 | 2016–2018 |
| EICHINGER OLIVER | 1 | 2016 |
| GOH KOK CHAI | 1 | 2016 |
| HEINRICH ALEXANDER | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Regenstauf, DE | 4 | 2016–2019 |
| Regensburg, DE | 2 | 2021 |