Inventor
Toshiji Taiji
Inventor
Kanagawa, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1038%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices15%
C09GPolishing compositions8%
H10BElectronic memory devices8%
PatentTitleYear
9,478,547'Semiconductor device and method of manufacturing the same'20169,337,093'Method of manufacturing semiconductor device'20168,329,584'Method of manufacturing semiconductor device'20127,955,980'Method of manufacturing semiconductor device'20117,601,640'Method of manfacturing semiconductor device'20097,229,570'Slurry for chemical mechanical polishing'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2009Patents assigned to NEC ELECTRONICS CORP (2)· patent assignee history
2007–2016Based in Kanagawa, JP· patent location history
2011–2016Patents assigned to RENESAS ELECTRONICS CORP (4)· patent assignee history
2012–2016Patents assigned to IGUCHI MANABU (2)· patent assignee history
2012–2016Patents assigned to OSHIDA DAISUKE (2)· patent assignee history
2012–2016Patents assigned to TAIJI TOSHIJI (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 4 | 2011–2016 |
| IGUCHI MANABU | 2 | 2012–2016 |
| NEC ELECTRONICS CORP | 2 | 2007–2009 |
| OSHIDA DAISUKE | 2 | 2012–2016 |
| TAIJI TOSHIJIself | 2 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 6 | 2007–2016 |