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Inventor

CHIN-HSIUNG HSU

Inventor
TW

Overview

2→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
G06FElectric digital data processing17%
H01LSemiconductor devices17%
H05KPrinted circuits17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
12,013,643Method of cutting conductive patterns202411,429,028Method of cutting conductive patterns2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2022–2024Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22022–2024
Locations
LocationPatentsSpan
TW22022–2024