Inventor
Rie Hattori
Inventor
Hitachinaka, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1057%
Y10TTechnical subjects covered by former us classification29%
C08LCompositions of macromolecular compounds14%
PatentTitleYear
7,202,570'Circuit tape having adhesive film semiconductor device and a method for manufacturing the same'20076,791,194'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20046,114,753'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20006,097,100'Resin sealed semiconductor devices and a process for manufacturing the same'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2007Patents assigned to HITACHI CABLE (3)· patent assignee history
2000–2004Patents assigned to HITACHI LTD (3)· patent assignee history
2000–2007Based in Hitachinaka, JP· patent location history
2007Patents assigned to RENESAS TECH CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CABLE | 3 | 2000–2007 |
| HITACHI LTD | 3 | 2000–2004 |
| RENESAS TECH CORP | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachinaka, JP | 4 | 2000–2007 |