Inventor
CHAYATHORN SAKLANG
Inventor
TH
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
H02JElectric power networks7%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution7%
PatentTitleYear
12,589,990Die stacking with controlled tilt and angular alignment202612,469,773Semiconductor device with attached battery and method therefor202512,406,911Semiconductor device with embedded battery and method therefor202512,125,771Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof202411,482,478Shielded electronic package and method of fabrication2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to NXP BV (2)· patent assignee history
2022–2025Based in TH· patent location history
2025Patents assigned to NXP USA INC (2)· patent assignee history
2026Patents assigned to ST MICROELECTRONICS INT NV (1)· patent assignee history
2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP BV | 2 | 2022–2024 |
| NXP USA INC | 2 | 2025 |
| ST MICROELECTRONICS INT NV | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TH | 4 | 2022–2025 |
| US | 1 | 2026 |