Inventor

Kiyokazu Ikeya

Inventor

Shizuoka, JP

Overview

33→

Patents

1987–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits33%

H01RElectrically-conductive connections32%

G01RMeasuring electric variables22%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%

F04DNon-positive-displacement pumps1%

F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants1%

F24FAir-conditioning1%

PatentTitleYear

8,388,365'Semiconductor device burn-in test socket'2013 7,601,008'Socket adaptor apparatus'2009 7,217,140'Contact assembly and socket for use with semiconductor packages'2007 6,848,928'Socket'2005 6,749,443'Socket for mounting an electronic device'2004 6,666,691'Socket for removably mounting electronic packages'2003 6,614,247'Socket apparatus and method for removably mounting an electronic package'2003 6,439,897'Socket apparatus for removably mounting electronic packages with improved contacting system'2002 6,402,537'Socket for removably mounting an electronic part'2002 6,350,138'Socket for removably mounting electronic parts having a plurality of conductive terminals such as BGA packages'2002 6,322,384'Electrical socket apparatus'2001 6,287,127'Electrical socket apparatus'2001 6,280,219'Socket apparatus for IC packages'2001 6,033,235'Socket apparatus particularly adapted for BGA type semiconductor devices'2000 6,027,355'Socket apparatus for removably loading electric parts'2000 5,816,828'Socket'1998 5,807,104'Test socket for detachable IC chip'1998 5,718,595'Socket apparatus'1998 5,690,281'Socket apparatus'1997 5,688,128'Detachable socket for an IC chip'1997 5,658,153'Socket apparatus'1997 5,628,635'Test socket for an integrated circuit'1997 5,482,471'Socket apparatus for IC package testing'1996 5,462,446'Socket apparatus'1995 5,460,538'Socket'1995 5,407,361'Socket'1995 5,364,284'Socket'1994 5,320,551'Socket'1994 5,139,437'Socket'1992 5,020,998'Test socket'1991 4,846,704'Test socket with improved contact engagement'1989 4,801,273'Socket'1989 4,715,823'Plug-in socket assembly for integrated circuit package'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2005Patents assigned to TEXAS INSTRUMENTS INC (30)· patent assignee history

1987–2013Based in Shizuoka, JP· patent location history

1989Based in Ueno, JP· patent location history

1996–2002Based in Sunto-gun, JP· patent location history

1997Based in Nishikamo-gun, JP· patent location history

2000Based in Mansfield, MA, US· patent location history

2007–2009Patents assigned to SENSATA TECHNOLOGIES INC (2)· patent assignee history

2013Patents assigned to IKEYA KIYOKAZU (1)· patent assignee history

2013Patents assigned to TAKAHASHI HIDEYUKI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TEXAS INSTRUMENTS INC	30	1987–2005
SENSATA TECHNOLOGIES INC	2	2007–2009
IKEYA KIYOKAZUself	1	2013
TAKAHASHI HIDEYUKI	1	2013

Locations

Location	Patents	Span
Shizuoka, JP	28	1987–2013
Sunto-gun, JP	2	1996–2002
Mansfield, Massachusetts, US	1	2000
Nishikamo-gun, JP	1	1997
Ueno, JP	1	1989