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Inventor

Erica L. Poelstra

Inventor
Boise, ID, US

Overview

3→
Patents
2019–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices20%
H10BElectronic memory devices20%
H10DInorganic electric semiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
G11CStatic stores7%
PatentTitleYear
11,024,735Methods of forming integrated circuitry202110,818,673Methods of forming integrated assemblies having conductive material along sidewall surfaces of semiconductor pillars202010,461,185Assemblies having conductive structures along pillars of semiconductor material2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2021Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2019–2021Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC32019–2021
Locations
LocationPatentsSpan
Boise, ID, US32019–2021