Inventor
Hidetaka Miyake
Inventor
Tokyo, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Hprimary
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool67%
B28DWorking stone or stone-like materials9%
C23CCoating metallic material6%
G06FElectric digital data processing3%
H01LSemiconductor devices3%
H04NPictorial communication, e.g. television3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,300,542Wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer201910,220,459Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus20199,950,379Wire electric discharge machining apparatus20189,833,854Workpiece retainer, wire electric discharge machining device, thin-plate manufacturing method, and semiconductor-wafer manufacturing method20179,707,638'Wire electric-discharge machining device, wire electric-discharge machining method, thin-plate manufacturing method, and semiconductor wafer manufacturing method'20179,643,270'Wire discharge-machining apparatus with parallel cutting wires'20179,387,548'Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method'20169,089,916'Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method'20159,050,672'Wire discharge-machining apparatus with parallel cutting wires'20158,829,383'Wire electric discharge machine and wire electric discharge machining method'20148,664,559'Electrical discharge machine'20147,518,081'Electric discharge machining apparatus'20096,881,918'Electric discharge machining apparatus'20056,788,019'Electric discharge machining device and electric discharge machining method'20046,781,080'Wire electric discharge machine with stored discharge energy threshold function'20046,622,139'Information retrieval apparatus and computer-readable recording medium having information retrieval program recorded therein'20036,621,033'Electrical discharge machining apparatus'20036,614,234'Electric discharge machine'20036,147,500'EDM with jump motion detecting reactive force'20006,086,684'Electric discharge surface treating method and apparatus'20005,973,498'EDM with jump motion detecting reactive force'19995,919,380'Three-dimensional electrical discharge machining method and apparatus utilizing NC control'19995,837,957'Electric discharge machining apparatus'19985,804,789'Surface treating method and apparatus by electric discharge machining'19985,524,067'Image processing device employing coding with edge information preserved'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996Based in Kanagawa, JP· patent location history
1998–2019Patents assigned to MITSUBISHI ELECTRIC CORP (23)· patent assignee history
1998–2019Based in Tokyo, JP· patent location history
1999–2003Based in Amagasaki, JP· patent location history
2003Based in Nakai-machi, JP· patent location history
2014–2018Patents assigned to MIYAKE HIDETAKA (8)· patent assignee history
2014–2018Patents assigned to SATO TATSUSHI (6)· patent assignee history
2014–2017Based in Chiyoda-ku, JP· patent location history
2015–2018Patents assigned to FUKUSHIMA KAZUHIKO (3)· patent assignee history
2015–2017Patents assigned to ITOKAZU ATSUSHI (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 23 | 1998–2019 |
| MIYAKE HIDETAKAself | 8 | 2014–2018 |
| SATO TATSUSHI | 6 | 2014–2018 |
| FUKUSHIMA KAZUHIKO | 3 | 2015–2018 |
| ITOKAZU ATSUSHI | 3 | 2015–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 18 | 1998–2019 |
| Amagasaki, JP | 3 | 1999–2003 |
| Chiyoda-ku, JP | 2 | 2014–2017 |
| Nakai-machi, JP | 1 | 2003 |
| Kanagawa, JP | 1 | 1996 |