Inventor
Tatsuo Ohtani
Inventor
Fukushima, JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing42%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
A61KPreparations for medical, dental or toiletry purposes4%
A61QSpecific use of cosmetics or similar toiletry preparations4%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling4%
B24DTools for grinding, buffing or sharpening4%
C08LCompositions of macromolecular compounds4%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
C10MLubricating compositions4%
PatentTitleYear
10,000,629Resin composition whose lubricity under wet conditions is maintained20189,622,961'Water-soluble polyalkylene oxide-modified product'20179,574,154'Sheet whose lubricity is maintained under wet conditions'20176,234,879'Method and apparatus for wafer chamfer polishing'20015,733,181'Apparatus for polishing the notch of a wafer'19985,727,990'Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus'19985,547,415'Method and apparatus for wafer chamfer polishing'19965,538,463'Apparatus for bevelling wafer-edge'19965,476,413'Apparatus for polishing the periphery portion of a wafer'19955,458,529'Apparatus for polishing notch portion of wafer'19955,429,544'Polishing apparatus for notch portion of wafer'19955,404,678'Wafer chamfer polishing apparatus with rotary circular dividing table'19955,317,836'Apparatus for polishing chamfers of a wafer'19945,316,620'Method and an apparatus for polishing wafer chamfers'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2001Patents assigned to SHINETSU HANDOTAI KK (9)· patent assignee history
1994–2001Based in Fukushima, JP· patent location history
1995–1998Patents assigned to FUJIKOSHI MACHINERY CORP (4)· patent assignee history
1995–1998Based in Nishishirakawa, JP· patent location history
2017–2018Patents assigned to OHTANI TATSUO (3)· patent assignee history
2017–2018Patents assigned to OZAWA HITOSHI (3)· patent assignee history
2017–2018Patents assigned to SUMITOMO SEIKA CHEMICALS (3)· patent assignee history
2017–2018Based in Himeji, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU HANDOTAI KK | 9 | 1994–2001 |
| FUJIKOSHI MACHINERY CORP | 4 | 1995–1998 |
| OHTANI TATSUOself | 3 | 2017–2018 |
| OZAWA HITOSHI | 3 | 2017–2018 |
| SUMITOMO SEIKA CHEMICALS | 3 | 2017–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fukushima, JP | 9 | 1994–2001 |
| Himeji, JP | 3 | 2017–2018 |
| Nishishirakawa, JP | 2 | 1995–1998 |