Inventor
Masanobu Iwasaki
Inventor
Tokyo, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
B24BMachines, devices, or processes for grinding or polishing14%
C23CCoating metallic material14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
B24CAbrasive or related blasting with particulate material11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
C09GPolishing compositions4%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
7,465,216'Polishing apparatus'20087,465,221'Polishing apparatus'20087,258,598'Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device'20076,727,170'Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof'20046,602,725'Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured thereby'20036,568,996'Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor'20036,303,944'Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured thereby'20016,278,187'Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof'20016,211,070'Peripheral structure of a chip as a semiconductor device, and manufacturing method thereof'20015,945,716'Semiconductor wafer and device structure'19995,470,799'Method for pretreating semiconductor substrate by photochemically removing native oxide'19955,429,991'Method of forming thin film for semiconductor device'19955,407,867'Method of forming a thin film on surface of semiconductor substrate'19955,240,505'Method of an apparatus for forming thin film for semiconductor device'19935,174,881'Apparatus for forming a thin film on surface of semiconductor substrate'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2003Patents assigned to MITSUBISHI ELECTRIC CORP (10)· patent assignee history
1992–2001Based in Hyogo, JP· patent location history
1995Patents assigned to MITSUBISHKI DENKI KABUSHIKI KA (1)· patent assignee history
2001–2008Based in Tokyo, JP· patent location history
2004–2008Patents assigned to RENESAS TECH CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 10 | 1992–2003 |
| RENESAS TECH CORP | 4 | 2004–2008 |
| MITSUBISHKI DENKI KABUSHIKI KA | 1 | 1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 8 | 2001–2008 |
| Hyogo, JP | 7 | 1992–2001 |