Inventor
CHAN H. YOO
Inventor
US
Overview
Patents· 42 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
G06FElectric digital data processing8%
H05KPrinted circuits8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G11CStatic stores7%
H10BElectronic memory devices5%
H10DInorganic electric semiconductor devices3%
H01HElectric switches1%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy1%
PatentTitleYear
12,543,261Solder mask fault fiber optics sensor202612,400,877Semiconductor devices with flexible reinforcement structure202512,277,056Memory device interface and method202512,253,943Memory device interface and method202512,243,801Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same202512,230,583Interposers for microelectronic devices202512,218,101Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same202512,218,119Stacked interposer structures202512,211,814Semiconductor interconnect structures with conductive elements, and associated systems and methods202512,199,068Methods of forming microelectronic device assemblies and packages202512,199,001Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same202512,170,275Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer202412,112,830Methods for memory power management and memory devices and systems employing the same202412,062,607Low cost three-dimensional stacking semiconductor assemblies202411,990,350Semiconductor devices with flexible reinforcement structure202411,929,349Semiconductor device having laterally offset stacked semiconductor dies202411,887,920Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods202411,868,253Memory device interface and method202411,824,010Interposers for microelectronic devices202311,791,315Semiconductor assemblies including thermal circuits and methods of manufacturing the same202311,789,890Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities202311,784,166Dual sided fan-out package having low warpage across all temperatures202311,728,307Semiconductor interconnect structures with conductive elements, and associated systems and methods202311,721,742Memory modules and memory packages including graphene layers for thermal management202311,688,658Semiconductor device202311,664,291Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same202311,589,480Tubular heat spreaders for memory modules and memory modules incorporating the same202311,581,231Stress tuned stiffeners for micro electronics package warpage control202311,574,820Semiconductor devices with flexible reinforcement structure202311,557,526Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same202311,508,422Methods for memory power management and memory devices and systems employing the same202211,476,241Interposer, microelectronic device assembly including same and methods of fabrication202211,462,472Low cost three-dimensional stacking semiconductor assemblies202211,444,067Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems202211,416,437Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities202211,410,981Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer202211,410,973Microelectronic device assemblies and packages and related methods and systems202211,386,004Memory device interface and method202211,309,285Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same202211,264,332Interposers for microelectronic devices202211,239,206Dual sided fan-out package having low warpage across all temperatures202211,206,749Tubular heat spreaders for memory modules and memory modules incorporating the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to MICRON TECHNOLOGY INC (38)· patent assignee history
2021–2026Based in US· patent location history
2023–2025Patents assigned to LODESTAR LICENSING GROUP LLC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 38 | 2021–2026 |
| LODESTAR LICENSING GROUP LLC | 4 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 42 | 2021–2026 |