Inventor
Masaharu Yoshida
Inventor
Fukuoka, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering8%
F16CShafts8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H04LTransmission of digital information, e.g. telegraphic communication5%
H05KPrinted circuits5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
A23LFoods, foodstuffs or non-alcoholic beverages, not otherwise provided for3%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations3%
PatentTitleYear
11,089,931Fan unit and cleaner having the same202110,400,820Linear motion guide unit201910,294,991Linear motion guide unit20199,897,141'Curvilinear motion rolling guide unit'20189,325,572'Component mounting system'20168,603,552'Method for producing foods from culture of Bacillus natto '20138,565,238'Industrial network system'20138,468,221'Network configuration method'20138,114,642'Method for producing vitamin K2 from culture of Bacillus natto'20127,207,868'Cutting apparatus'20076,238,208'Method and apparatus for cooling furnace'20016,213,356'Bump forming apparatus and bump forming method'20015,774,207'Light scanner'19985,606,182'Optical semiconductor device for optical communications with increased positional accuracy of an optical access and method of fabricating the same'19975,564,188'Rolling guide unit production process'19965,500,502'Bonding method and apparatus'19965,374,126'Rolling guide unit and its production process'19945,305,944'Bonding method and bonding apparatus'19945,302,801'Laser bonding apparatus'19945,250,781'Laser bonding apparatus'19935,246,513'Die bonding apparatus and method of controlling the same'19935,116,670'Allyl ester resin composition and laminated sheet using the same'19924,913,335'Method and apparatus for die bonding'19903,958,518'Incinerator for oil-containing waste sludge and method thereof'19763,934,056'Resin compositions of high adhesivity comprising E/VA copolymer, chlorinated or chlorosulfonated polyethylene, an unsaturated acid and a peroxy compound'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2001Patents assigned to MITSUBISHI ELECTRIC CORP (8)· patent assignee history
1990–1997Based in Fukuoka, JP· patent location history
1992–1996Based in Kanagawa, JP· patent location history
1994–2019Patents assigned to NIPPON THOMPSON CO LTD (5)· patent assignee history
1998–2019Based in Tokyo, JP· patent location history
2012–2013Patents assigned to YOSHIDA MASAHARU (4)· patent assignee history
2012–2013Based in Konan, JP· patent location history
2013–2016Patents assigned to HITACHI HIGH TECH INSTR CO LTD (3)· patent assignee history
2013Patents assigned to FUNATSU TERUNOBU (2)· patent assignee history
2013–2016Based in Oizumi-machi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 8 | 1990–2001 |
| NIPPON THOMPSON CO LTD | 5 | 1994–2019 |
| YOSHIDA MASAHARUself | 4 | 2012–2013 |
| HITACHI HIGH TECH INSTR CO LTD | 3 | 2013–2016 |
| FUNATSU TERUNOBU | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fukuoka, JP | 7 | 1990–1997 |
| Tokyo, JP | 5 | 1998–2019 |
| Oizumi-machi, JP | 3 | 2013–2016 |
| Kanagawa, JP | 3 | 1992–1996 |
| Konan, JP | 2 | 2012–2013 |