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Inventor

Michael Hutzel

Inventor
Dachau, DE

Overview

2→
Patents
2019–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder17%
B23KSoldering or unsoldering17%
B29CShaping or joining of plastics17%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering17%
Y02PClimate change mitigation technologies in the production or processing of goods17%
PatentTitleYear
10,946,446Method and device for producing a three-dimensional object202110,343,216Method and device for producing a three-dimensional object2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2021Patents assigned to EOS GMBH ELECTRO OPTICAL SYSTEMS (2)· patent assignee history
2019–2021Based in Dachau, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EOS GMBH ELECTRO OPTICAL SYSTEMS22019–2021
Locations
LocationPatentsSpan
Dachau, DE22019–2021