Inventor

Mark A. Takacs

Inventor

Poughkeepsie, NY, US

Overview

18→

Patents

1986–2003

Patent span

Electricity

Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%

H05KPrinted circuits19%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%

Y10TTechnical subjects covered by former us classification10%

C04BLime, magnesia6%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

C09KMaterials for miscellaneous applications, not provided for elsewhere4%

Y02PClimate change mitigation technologies in the production or processing of goods4%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application2%

PatentTitleYear

6,596,621'Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate'2003 6,555,912'Corrosion-resistant electrode structure for integrated circuit decoupling capacitors'2003 6,336,262'Process of forming a capacitor with multi-level interconnection technology'2002 5,808,853'Capacitor with multi-level interconnection technology'1998 5,277,725'Process for fabricating a low dielectric composite substrate'1994 5,213,704'Process for making a compliant thermally conductive compound'1993 5,139,851'Low dielectric composite substrate'1992 5,135,595'Process for fabricating a low dielectric composite substrate'1992 5,094,769'Compliant thermally conductive compound'1992 4,871,619'Electronic components comprising polymide dielectric layers'1989 4,749,621'Electronic components comprising polyimide-filled isolation structures'1988 4,699,803'Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers'1987 4,665,007'Planarization process for organic filling of deep trenches'1987 4,656,050'Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers'1987 4,654,223'Method for forming a film of dielectric material on an electric component'1987 4,622,383'Method for the fractionation of reactive terminated polymerizable oligomers'1986 4,599,136'Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials'1986 4,568,601'Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1986–2003Patents assigned to IBM (18)· patent assignee history

1986–2003Based in Poughkeepsie, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	18	1986–2003

Locations

Location	Patents	Span
Poughkeepsie, New York, US	18	1986–2003