Inventor
So-Young Lim
Inventor
Hwaseong-si, KR
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices16%
G09GArrangements or circuits for control of indicating devices using static means to present variable information11%
H05KPrinted circuits11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
G01RMeasuring electric variables8%
H01QAntennas, i.e. radio aerials5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein3%
G06FElectric digital data processing3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
10,997,882Short detection device, a short detection circuit and a display device using the same202110,699,974Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device20209,869,717'Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same'20189,437,526'Chip on film package including distributed via plugs'20169,280,182'Chip on film package and display device including the same'20169,059,162'Chip on film (COF) substrate, COF package and display device including the same'20159,059,067'Semiconductor device with interposer and method manufacturing same'20158,581,373'Tape package'20138,502,084'Semiconductor package including power ball matrix and power ring having improved power integrity'20138,436,462'Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure'20138,384,407'Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same'20137,936,232'Substrate for semiconductor package'20117,760,044'Substrate for semiconductor package'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (13)· patent assignee history
2010–2011Based in Yongin-si, KR· patent location history
2013–2015Patents assigned to LIM SO-YOUNG (5)· patent assignee history
2013Patents assigned to KIM DONG-HAN (2)· patent assignee history
2013Patents assigned to BAE KWANG-JIN (1)· patent assignee history
2013–2020Based in Hwaseong-si, KR· patent location history
2015Patents assigned to CHOI YUN-SEOK (1)· patent assignee history
2021Based in Suwon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 13 | 2010–2021 |
| LIM SO-YOUNGself | 5 | 2013–2015 |
| KIM DONG-HAN | 2 | 2013 |
| BAE KWANG-JIN | 1 | 2013 |
| CHOI YUN-SEOK | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hwaseong-si, KR | 10 | 2013–2020 |
| Yongin-si, KR | 2 | 2010–2011 |
| Suwon-si, KR | 1 | 2021 |