Inventor

Yutaka Aoki

Inventor
Ome, JP

Overview

65→
Patents
1977–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 65 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
C08LCompositions of macromolecular compounds7%
H01QAntennas, i.e. radio aerials7%
G01SRadio direction-finding6%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
B62DMotor vehicles4%
Y10TTechnical subjects covered by former us classification4%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
H04WWireless communication networks3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
11,098,193(Meth)acrylate resin material, surface hardness enhancer, polycarbonate resin composition, and molded article202111,027,777Steering control apparatus202110,875,575Steering assistance device202010,842,396Vibration waveform sensor and waveform analysis device202010,698,098Millimeter wave radar and millimeter wave radar detection method202010,513,606(Meth)acrylate resin material, surface hardness enhancer, polycarbonate resin composition, and molded article201910,495,747Snow quality measuring apparatus and snow quality measuring method201910,427,712Automatic driving system201910,239,557Vehicle travel control device and autonomous driving control method201910,048,369Radar assembly201810,018,539System and method for retrieval treatment of proteins in formalin-fixed paraffin-embedded tissue section20189,822,235'Glass-containing thermoplastic acrylic resin composition and molded article thereof'2017D0801432'Label'20179,680,204'Antenna device'20179,646,863'Multilayer styrenic resin sheet'20179,499,739'Thermoplastic resin composition, production method of thermoplastic resin composition, molding material, and light-emitting body'20169,093,757'Antenna'20159,090,820'Thermoplastic resin composition, production method of thermoplastic resin composition, molding material, and light-emitting body'20158,816,922'Multi-frequency antenna'20148,717,253'Antenna'20148,610,634'Antenna'20138,440,305'Electrically conductive sheet'20138,283,625'Method of preparing sample for matrix-assisted laser desorption ionization mass spectrometry and matrix-assisted laser desorption ionization mass spectrometry'20128,148,456'Conductive resin composition and conductive sheets comprising the same'20128,110,882'Semiconductor device with magnetic powder mixed therein and manufacturing method thereof'20127,984,786'Electric power steering device'20117,852,258'Method and system for reducing power loss of transmitted radio wave through cover'2010RE041511'Semiconductor device having a thin-film circuit element provided above an integrated circuit'20107,710,312'Radar apparatus and mounting structure for radar apparatus'20107,705,771'Radar apparatus and mounting structure for radar apparatus'20107,688,258'Radio wave receiving system, imaging system and radio wave receiving method'20107,546,003'Suspension board with circuit and producing method thereof'20097,460,060'Electromagnetic wave transmitting/receiving module and imaging sensor having electromagnetic wave transmitting/receiving module'20087,449,772'Chip-type electronic component including thin-film circuit elements'20087,312,684'Semiconductor device'20077,245,264'High frequency module and array of the same'20077,136,426'Communication system including a wire network linked with another network via radio waves'20067,030,494'Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof'20067,012,490'High frequency signal transmission structure'20067,003,301'Communication system, communication method and mobile terminal'20066,996,411'Wireless communication terminal'20066,909,893'Wireless communication system, fixed base station and mobile terminal station'20056,870,256'Semiconductor device having a thin-film circuit element provided above an integrated circuit'20056,847,066'Semiconductor device'20056,788,951'Radio communication system using variable packet length'20046,690,376'Storage medium for storing animation data, image processing method using same, and storage medium storing image processing programs'20046,667,078'Transparent resin plate from epoxy resin and anhydride or partial ester thereof'20036,639,299'Semiconductor device having a chip size package including a passive element'20036,603,567'Container for recording medium, printing apparatus, and printing method'20036,501,169'Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise'20026,407,183'Casting from epoxy resin and anhydride (partial ester)'20026,153,921'Diode device'20005,974,231'Driving apparatus for printer capable of recording multiple gradation, and printer with driving apparatus'19995,769,622'Gas combustion apparatus'19985,720,608'Combusting apparatus with storage battery included therein'19985,599,181'Combustion apparatus having a built-in storage battery'19975,422,995'Method and means for fast writing of run length coded bit strings into bit mapped memory and the like'19955,313,227'Graphic display system capable of cutting out partial images'19945,205,727'Pulse combustor'19935,201,649'Pulse combustor'19934,925,730'Liquid active substance slow releasing device'19904,908,714'Image transmission apparatus'19904,141,793'Process for preparation of coke and carbonizer therefor'19794,119,409'Process for the preparation of synthetic coking coal'19784,033,728'Synthetic caking coal and method for production thereof'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–2020Based in Tokyo, JP· patent location history
1990–2009Patents assigned to NITTO DENKO CORP (4)· patent assignee history
2002–2017Patents assigned to CASIO COMPUTER CO LTD (15)· patent assignee history
2002–2017Based in Ome, JP· patent location history
2004–2018Patents assigned to DENSO CORP (7)· patent assignee history
2004–2010Based in Nisshin, JP· patent location history
2011–2021Patents assigned to TOYOTA MOTOR CO LTD (5)· patent assignee history
2012–2017Patents assigned to AOKI YUTAKA (10)· patent assignee history
2015–2021Based in Otake, JP· patent location history
2019–2021Based in Miyoshi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CASIO COMPUTER CO LTD152002–2017
AOKI YUTAKAself102012–2017
DENSO CORP72004–2018
TOYOTA MOTOR CO LTD52011–2021
NITTO DENKO CORP41990–2009
Locations
LocationPatentsSpan
Ome, JP152002–2017
Nisshin, JP102004–2010
Tokyo, JP71977–2020
Otake, JP52015–2021
Miyoshi, JP42019–2021