Inventor
Kostas Papathomas
Inventor
Endicott, NY, US
Overview
Patents· 59 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification20%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
H01BCables5%
B23KSoldering or unsoldering3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
C08JWorking-up1%
B05CApparatus for applying fluent materials to surfaces, in general1%
PatentTitleYear
9,756,724'Method of making a circuitized substrate'20178,445,094'Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers'20138,211,790'Multilayered circuitized substrate with P-aramid dielectric layers and method of making same'20128,198,551'Power core for use in circuitized substrate and method of making same'20128,084,863'Circuitized substrate with continuous thermoplastic support film dielectric layers'20118,063,315'Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate'20117,931,830'Dielectric composition for use in circuitized substrates and circuitized substrate including same'20117,646,098'Multilayered circuitized substrate with p-aramid dielectric layers and method of making same'20107,541,265'Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate'20097,508,076'Information handling system including a circuitized substrate having a dielectric layer without continuous fibers'20097,470,990'Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same'20087,429,789'Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same'20087,416,972'Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion'20087,416,996'Method of making circuitized substrate'20087,348,677'Method of providing printed circuit board with conductive holes and board resulting therefrom'20087,270,845'Dielectric composition for forming dielectric layer for use in circuitized substrates'20077,211,289'Method of making multilayered printed circuit board with filled conductive holes'20077,145,221'Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same'20067,078,816'Circuitized substrate'20066,609,296'Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means'20036,555,762'Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition'20036,376,158'Methods for selectively filling apertures'20026,323,436'High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer'20016,207,595'Laminate and method of manufacture thereof'20016,199,751'Polymer with transient liquid phase bondable particles'20016,194,024'Via fill compositions for direct attach of devices and methods for applying same'20016,178,093'Information handling system with circuit assembly having holes filled with filler material'20016,138,350'Process for manufacturing a circuit board with filled holes'20006,134,772'Via fill compositions for direct attach of devices and methods of applying same'20006,127,097'Photoresist develop and strip solvent compositions and method for their use'20006,125,531'Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means'20006,127,025'Circuit board with wiring sealing filled holes'20006,114,098'Method of filling an aperture in a substrate'20006,114,019'Circuit board assemblies having filled vias free from bleed-out'20006,106,891'Via fill compositions for direct attach of devices and method for applying same'20006,087,021'Polymer with transient liquid phase bondable particles'20006,079,100'Method of making a printed circuit board having filled holes and fill member for use therewith'20006,066,889'Methods of selectively filling apertures'20006,000,129'Process for manufacturing a circuit with filled holes'19995,887,345'Method for applying curable fill compositon to apertures in a substrate'19995,863,332'Fluid jet impregnating and coating device with thickness control capability'19995,822,856'Manufacturing circuit board assemblies having filled vias'19985,766,670'Via fill compositions for direct attach of devices and methods for applying same'19985,713,508'Stabilization of conductive adhesive by metallurgical bonding'19985,668,059'Solder interconnection structure and process for making'19975,656,862'Solder interconnection structure'19975,637,442'Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol'19975,571,417'Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol'19965,571,593'Via fill compositions for direct attach of devices and methods for applying same'19965,542,602'Stabilization of conductive adhesive by metallurgical bonding'19965,471,096'Solder interconnection from a composition containing a mixture of dicyanates'19955,310,428'Solvent stabilization process and method of recovering solvent'19945,268,260'Photoresist develop and strip solvent compositions and method for their use'19935,250,848'Solder interconnection structure'19935,194,930'Dielectric composition and solder interconnection structure for its use'19935,143,756'Fiber reinforced epoxy prepreg and fabrication thereof'19925,089,440'Solder interconnection structure and process for making'19925,015,719'Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods'19914,999,699'Solder interconnection structure and process for making'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2003Patents assigned to IBM (40)· patent assignee history
1991–2017Based in Endicott, NY, US· patent location history
2006–2013Patents assigned to ENDICOTT INTERCONNECT TECH INC (18)· patent assignee history
2011–2017Patents assigned to MARKOVICH VOYA R (4)· patent assignee history
2011–2017Patents assigned to PAPATHOMAS KOSTAS I (4)· patent assignee history
2011–2012Patents assigned to JAPP ROBERT M (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 40 | 1991–2003 |
| ENDICOTT INTERCONNECT TECH INC | 18 | 2006–2013 |
| MARKOVICH VOYA R | 4 | 2011–2017 |
| PAPATHOMAS KOSTAS Iself | 4 | 2011–2017 |
| JAPP ROBERT M | 3 | 2011–2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 59 | 1991–2017 |