Inventor
Kyu Oh Lee
Inventor
Chandler, AZ, US
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H01LSemiconductor devices27%
H05KPrinted circuits10%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%
B23KSoldering or unsoldering4%
C22CAlloys4%
H10DInorganic electric semiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock2%
PatentTitleYear
10,777,514Techniques for an inductor at a second level interface202010,692,847Inorganic interposer for multi-chip packaging202010,643,994Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same202010,468,352Semiconductor packages with embedded bridge interconnects201910,468,374Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate201910,446,500Semiconductor packages with embedded bridge interconnects201910,424,561Integrated circuit structures with recessed conductive contacts for package on package201910,384,431Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate201910,373,951Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same201910,373,900Tin-zinc microbump structures and method of making same201910,297,563Copper seed layer and nickel-tin microbump structures201910,157,847Semiconductor packages with embedded bridge interconnects201810,121,752Surface finishes for interconnection pads in microelectronic structures201810,076,808Lead-free solder alloy201810,026,691Package substrate having noncircular interconnects20189,947,631Surface finishes for interconnection pads in microelectronic structures20189,917,044'Package with bi-layered dielectric structure'20189,865,568'Integrated circuit structures with recessed conductive contacts for package on package'20189,837,341Tin-zinc microbump structures20179,791,470'Magnet placement for integrated sensor packages'20179,607,947'Reliable microstrip routing for electronics components'20179,505,607'Methods of forming sensor integrated packages and structures formed thereby'20169,501,068'Integration of pressure sensors into integrated circuit fabrication and packaging'20169,391,025'Reliable microstrip routing for electronics components'20169,355,952'Device packaging with substrates having embedded lines and metal defined pads'20169,260,294'Integration of pressure or inertial sensors into integrated circuit fabrication and packaging'20169,093,313'Device packaging with substrates having embedded lines and metal defined pads'20159,041,205'Reliable microstrip routing for electronics components'20158,835,217'Device packaging with substrates having embedded lines and metal defined pads'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to INTEL CORP (27)· patent assignee history
2014–2019Patents assigned to LEE KYU OH (6)· patent assignee history
2014–2020Based in Chandler, AZ, US· patent location history
2015–2017Patents assigned to ALTUNYURT NEVIN (3)· patent assignee history
2015–2017Patents assigned to BHARATH KRISHNA (3)· patent assignee history
2015–2017Patents assigned to KARHADE OMKAR G (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 27 | 2014–2020 |
| LEE KYU OHself | 6 | 2014–2019 |
| ALTUNYURT NEVIN | 3 | 2015–2017 |
| BHARATH KRISHNA | 3 | 2015–2017 |
| KARHADE OMKAR G | 3 | 2015–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 29 | 2014–2020 |