Inventor

Jason Smith

Inventor
Pasadena, CA, US

Overview

4→
Patents
2007–2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

A61Bprimary
A61BDiagnosis9%
A61MDevices for introducing media into, or onto, the body9%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material9%
B29CShaping or joining of plastics9%
B29LIndexing scheme associated with subclass b29c, relating to particular articles9%
F16LPipes9%
G02BOptical elements, systems or apparatus9%
G06FElectric digital data processing9%
G21KHandling of particles or ionising radiation not otherwise provided for9%
H04LTransmission of digital information, e.g. telegraphic communication9%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007Patents assigned to SMITH JASON (1)· patent assignee history
2007Based in Chicago, IL, US· patent location history
2018Patents assigned to INTEGRATION TECH LIMITED (1)· patent assignee history
2018Based in Oxfordshire, GB· patent location history
2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
2019Patents assigned to SMITH JASON EDWARD (1)· patent assignee history
2019Based in Pasadena, CA, US· patent location history
2019Based in San Francisco, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEGRATION TECH LIMITED12018
SAMSUNG ELECTRONICS CO LTD12019
SMITH JASONself12007
SMITH JASON EDWARDself12019
Locations
LocationPatentsSpan
Pasadena, California, US12019
San Francisco, California, US12019
Oxfordshire, GB12018
Chicago, Illinois, US12007