Inventor
RALF LERNER
Inventor
DE
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10DInorganic electric semiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
G06FElectric digital data processing5%
H01GCapacitors5%
PatentTitleYear
12,334,274Trench capacitors202511,916,104Trench insulation structure with enlarged electrically conductive side wall202411,829,074Geometrically shaped components in an assembly for a transfer print and associated methods202311,600,603Semiconductor device along with multi-functional units and method for manufacturing a semiconductor device202311,437,266Method of manufacturing semiconductor devices to increase yield in micro-transfer printing202211,355,582Trench insulation structure with enlarged electrically conductive side wall2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to X FAB SEMICONDUCTOR FOUNDRIES GMBH (4)· patent assignee history
2022–2025Based in DE· patent location history
2023–2025Patents assigned to X FAB GLOBAL SERVICES GMBH (2)· patent assignee history
2025Patents assigned to MELEXIS TECHNOLOGIES NV (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| X FAB SEMICONDUCTOR FOUNDRIES GMBH | 4 | 2022–2024 |
| X FAB GLOBAL SERVICES GMBH | 2 | 2023–2025 |
| MELEXIS TECHNOLOGIES NV | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 6 | 2022–2025 |