Inventor
Yoshikuni Tateyama
Inventor
Oita, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
B24BMachines, devices, or processes for grinding or polishing21%
C09GPolishing compositions12%
H10BElectronic memory devices7%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
8,685,857'Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device'20148,292,694'Substrate holding mechanism, substrate polishing apparatus and substrate polishing method'20128,174,125'Manufacturing method of a semiconductor device'20128,078,306'Polishing apparatus and polishing method'20117,985,685'Method of manufacturing semiconductor device'20117,951,717'Post-CMP treating liquid and manufacturing method of semiconductor device using the same'20117,888,139'Fabricating method of nonvolatile semiconductor storage apparatus'20117,883,394'Substrate holding mechanism, substrate polishing apparatus and substrate polishing method'20117,521,350'Manufacturing method of a semiconductor device'20097,452,819'Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device'20087,419,420'Substrate holding mechanism, substrate polishing apparatus and substrate polishing method'20087,144,804'Semiconductor device and method of manufacturing the same'20067,101,801'Method of manufacturing semiconductor device using chemical mechanical polishing'20067,042,099'Semiconductor device containing a dummy wire'20066,984,582'Method of making semiconductor device by polishing with intermediate clean polishing'20066,858,936'Semiconductor device having an improved construction in the interlayer insulating film'20056,835,116'Polishing apparatus'20046,645,053'Polishing apparatus'20036,561,876'CMP method and semiconductor manufacturing apparatus'20036,338,744'Polishing slurry and polishing method'20026,036,582'Polishing apparatus'20005,664,989'Polishing pad, polishing apparatus and polishing method'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2014Patents assigned to TOSHIBA KK (20)· patent assignee history
1997–2011Based in Hiratsuka, JP· patent location history
2000–2012Patents assigned to EBARA CORP (7)· patent assignee history
2006–2014Based in Oita, JP· patent location history
2011–2014Patents assigned to TATEYAMA YOSHIKUNI (4)· patent assignee history
2011Based in Kanagawa, JP· patent location history
2012–2014Patents assigned to YANO HIROYUKI (3)· patent assignee history
2012–2014Patents assigned to MINAMIHABA GAKU (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 20 | 1997–2014 |
| EBARA CORP | 7 | 2000–2012 |
| TATEYAMA YOSHIKUNIself | 4 | 2011–2014 |
| YANO HIROYUKI | 3 | 2012–2014 |
| MINAMIHABA GAKU | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Oita, JP | 10 | 2006–2014 |
| Hiratsuka, JP | 10 | 1997–2011 |
| Kanagawa, JP | 2 | 2011 |