Inventor
Hiroaki Takezawa
Inventor
Nara, JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits22%
Y10TTechnical subjects covered by former us classification19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Y02PClimate change mitigation technologies in the production or processing of goods11%
C09JAdhesives7%
H01BCables7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
H01RElectrically-conductive connections4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations2%
PatentTitleYear
10,329,112Drive transmission apparatus and image forming apparatus20197,755,893'Display device'20107,705,536'Display device'20107,468,206'Organic ultra-thin film'20087,151,306'Electronic part, and electronic part mounting element and an process for manufacturing such the articles'20066,916,433'Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same'20056,853,074'Electronic part, an electronic part mounting element and a process for manufacturing such the articles'20056,814,893'Conductive adhesive agent, packaging structure, and method for manufacturing the same structure'20046,749,889'Method for producing mounting structure for an electronic component'20046,749,774'Conductive adhesive and connection structure using the same'20046,694,613'Method for producing a printed-circuit board having projection electrodes'20046,675,474'Electronic component mounted member and repair method thereof'20046,666,994'Conductive adhesive and packaging structure using the same'20036,620,345'Conductive adhesive agent, packaging structure, and method for manufacturing the same structure'20036,569,512'Mounting structure for an electronic component and method for producing the same'20036,524,721'Conductive adhesive and packaging structure using the same'20036,521,144'Conductive adhesive and connection structure using the same'20036,512,183'Electronic component mounted member and repair method thereof'20036,510,059'Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module'20036,495,247'Functional member having molecular layer on its surface and method of producing the same'20026,488,869'Conductive paste, its manufacturing method, and printed wiring board using the same'20026,465,082'Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body'20026,429,382'Electrical mounting structure having an elution preventive film'20026,376,051'Mounting structure for an electronic component and method for producing the same'20026,300,576'Printed-circuit board having projection electrodes and method for producing the same'20016,207,550'Method for fabricating bump electrodes with a leveling step for uniform heights'20016,203,919'Insulating film and method for preparing the same'20015,817,190'Flux for soft soldering'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2006Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (23)· patent assignee history
1998–2010Based in Nara, JP· patent location history
2001–2008Based in Katano, JP· patent location history
2002–2003Based in Osaka, JP· patent location history
2004Patents assigned to MATSUSHITA ELECTRIC INDUSTIRAL (1)· patent assignee history
2008–2010Patents assigned to PANASONIC CORP (3)· patent assignee history
2019Patents assigned to CANON KK (1)· patent assignee history
2019Based in Kashiwa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 23 | 1998–2006 |
| PANASONIC CORP | 3 | 2008–2010 |
| CANON KK | 1 | 2019 |
| MATSUSHITA ELECTRIC INDUSTIRAL | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nara, JP | 18 | 1998–2010 |
| Katano, JP | 7 | 2001–2008 |
| Osaka, JP | 2 | 2002–2003 |
| Kashiwa, JP | 1 | 2019 |