Inventor

Lawrence Chung-Lai Lei

Inventor
Milpitas, CA, US

Overview

79→
Patents
1987–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 79 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material36%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
C30BSingle-crystal growth6%
H01JElectric discharge tubes or discharge lamps5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
G01BMeasuring length, thickness or similar linear dimensions2%
B01DSeparation1%
B05DProcesses for applying fluent materials to surfaces, in general1%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors1%
PatentTitleYear
10,854,497Apparatus and method of selective turning over a row of substrates in an array of substrates in a processing system20209,031,685'Atomic layer deposition apparatus'20158,626,330'Atomic layer deposition apparatus'20148,367,565'Methods and systems of transferring, docking and processing substrates'20138,342,119'Self aligning non contact shadow ring process kit'20138,268,734'Methods and systems of transferring, docking and processing substrates'20128,110,511'Methods and systems of transferring a substrate to minimize heat loss'20128,027,746'Atomic layer deposition apparatus'20117,923,069'Multi-station deposition apparatus and method'20117,897,525'Methods and systems of transferring, docking and processing substrates'20117,860,597'Atomic layer deposition apparatus'20107,846,840'Method for forming tungsten materials during vapor deposition processes'20107,794,789'Multi-station deposition apparatus and method'20107,777,483'Method and apparatus for measuring a thickness of a layer of a wafer'20107,722,719'Gas baffle and distributor for semiconductor processing chamber'20107,705,275'Substrate support having brazed plates and resistance heater'20107,674,715'Method for forming tungsten materials during vapor deposition processes'20107,660,644'Atomic layer deposition apparatus'20107,547,465'Multi-station deposition apparatus and method'20097,465,666'Method for forming tungsten materials during vapor deposition processes'20087,355,394'Apparatus and method of dynamically measuring thickness of a layer of a substrate'20087,235,486'Method for forming tungsten materials during vapor deposition processes'20077,115,494'Method and system for controlling the presence of fluorine in refractory metal layers'20067,112,961'Method and apparatus for dynamically measuring the thickness of an object'20067,085,616'Atomic layer deposition apparatus'20067,033,922'Method and system for controlling the presence of fluorine in refractory metal layers'20066,932,871'Multi-station deposition apparatus and method'20056,866,746'Clamshell and small volume chamber with fixed substrate support'20056,855,368'Method and system for controlling the presence of fluorine in refractory metal layers'20056,827,815'Showerhead assembly for a processing chamber'20046,793,766'Apparatus having platforms positioned for precise centering of semiconductor wafers during processing'20046,777,352'Variable flow deposition apparatus and method in semiconductor substrate processing'20046,729,824'Dual robot processing system'20046,718,126'Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition'20046,603,269'Resonant chamber applicator for remote plasma source'20036,589,352'Self aligning non contact shadow ring process kit'20036,551,929'Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques'20036,517,592'Cold trap assembly'20036,503,331'Tungsten chamber with stationary heater'20036,494,955'Ceramic substrate support'20026,436,192'Apparatus for aligning a wafer'20026,430,468'Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber'20026,375,748'Method and apparatus for preventing edge deposition'20026,374,512'Method for reducing contamination of a substrate in a substrate processing system'20026,364,949'300 mm CVD chamber design for metal-organic thin film deposition'20026,364,954'High temperature chemical vapor deposition chamber'20026,302,965'Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfaces'20016,302,964'One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system'20016,296,712'Chemical vapor deposition hardware and process'20016,277,199'Chamber design for modular manufacturing and flexible onsite servicing'20016,223,447'Fastening device for a purge ring'20016,206,971'Integrated temperature controlled exhaust and cold trap assembly'20016,159,299'Wafer pedestal with a purge ring'20006,106,625'Reactor useful for chemical vapor deposition of titanium nitride'20006,103,014'Chemical vapor deposition chamber'20006,096,135'Method and apparatus for reducing contamination of a substrate in a substrate processing system'20006,086,677'Dual gas faceplate for a showerhead in a semiconductor wafer processing system'20006,083,321'Fluid delivery system and method'20006,063,441'Processing chamber and method for confining plasma'20006,063,440'Method for aligning a wafer'20006,050,446'Pivoting lid assembly for a chamber'20005,968,276'Heat exchange passage connection'19995,935,338'Chemical vapor deposition chamber'19995,888,304'Heater with shadow ring and purge above wafer surface'19995,882,419'Chemical vapor deposition chamber'19995,856,240'Chemical vapor deposition of a thin film onto a substrate'19995,810,936'Plasma-inert cover and plasma cleaning process and apparatus employing same'19985,800,686'Chemical vapor deposition chamber with substrate edge protection'19985,766,365'Removable ring for controlling edge deposition in substrate processing apparatus'19985,705,080'Plasma-inert cover and plasma cleaning process'19985,695,568'Chemical vapor deposition chamber'19975,556,476'Controlling edge deposition on semiconductor substrates'19965,516,367'Chemical vapor deposition chamber with a purge guide'19965,476,548'Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring'19955,468,298'Bottom purge manifold for CVD tungsten process'19955,421,894'Power loss recovery for wafer heater'19955,213,650'Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer'19935,075,256'Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer'19914,714,536'Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987Based in Mountain View, CA, US· patent location history
1991–2015Patents assigned to APPLIED MATERIALS INC (73)· patent assignee history
1991–2000Based in Cupertino, CA, US· patent location history
1995–2020Based in Milpitas, CA, US· patent location history
2003Based in Sunnyvale, CA, US· patent location history
2004Based in Milipitas, CA, US· patent location history
2011–2013Patents assigned to ARCHERS INC (4)· patent assignee history
2012–2014Patents assigned to LEI LAWRENCE CHUNG-LAI (4)· patent assignee history
2012–2013Patents assigned to LIU REX (3)· patent assignee history
2012–2013Patents assigned to MAK ALFRED (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC731991–2015
ARCHERS INC42011–2013
LEI LAWRENCE CHUNG-LAIself42012–2014
LIU REX32012–2013
MAK ALFRED32012–2013
Locations
LocationPatentsSpan
Milpitas, California, US711995–2020
Cupertino, California, US51991–2000
Milipitas, California, US12004
Sunnyvale, California, US12003
Mountain View, California, US11987