Inventor

Charles H. Perry

Inventor

Poughkeepsie, NY, US

Overview

48→

Patents

1985–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 48 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits14%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%

Y10TTechnical subjects covered by former us classification14%

G01RMeasuring electric variables9%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%

C04BLime, magnesia5%

H02KDynamo-electric machines4%

B60KArrangement or mounting of propulsion units or of transmissions in vehicles3%

B60LPropulsion of electrically-propelled vehicles3%

B60WConjoint control of vehicle sub-units of different type or different function3%

PatentTitleYear

11,077,840Machine for augmentation, storage, and conservation of vehicle motive energy2021 10,075,050Switched reluctance motor and switched reluctance apparatus for hybrid vehicles2018 9,963,137Machine for augmentation, storage, and conservation of vehicle motive energy2018 9,260,005'Machine for augmentation, storage, and conservation of vehicle motive energy'2016 8,700,239'Machine for augmentation, storage, and conservation of vehicle motive energy'2014 D0664487'Rotor'2012 D0664080'Rotor'2012 7,278,207'Method of making an electronic package'2007 6,988,310'Method of assembling an interconnect device assembly'2006 6,961,995'Method of making an electronic package'2005 6,858,111'Conductive polymer interconnection configurations'2005 6,848,914'Electrical coupling of substrates by conductive buttons'2005 6,711,810'Method of assembling a land grid array module'2004 6,548,175'Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof'2003 6,528,145'Polymer and ceramic composite electronic substrates'2003 6,529,021'Self-scrub buckling beam probe'2003 6,486,415'Compliant layer for encapsulated columns'2002 6,458,623'Conductive adhesive interconnection with insulating polymer carrier'2002 6,404,211'Metal buckling beam probe'2002 6,351,134'Semiconductor wafer test and burn-in'2002 6,333,104'Conductive polymer interconnection configurations'2001 6,275,051'Segmented architecture for wafer test and burn-in'2001 6,227,943'Method and system for pre-cleaning and post-cleaning deposited metal'2001 6,221,269'Method of etching molybdenum metal from substrates'2001 6,174,175'High density Z-axis connector'2001 6,038,931'Method and apparatus for the testing of plastically deformable objects'2000 6,020,750'Wafer test and burn-in platform using ceramic tile supports'2000 5,977,787'Large area multiple-chip probe assembly and method of making the same'1999 5,976,710'Low TCE polyimides as improved insulator in multilayer interconnect structures'1999 5,929,651'Semiconductor wafer test and burn-in'1999 5,788,808'Apparatus for forming cavity substrates using compressive pads'1998 5,759,320'Method of forming cavity substrates using compressive pads'1998 5,629,631'Interface card for a probe card assembly'1997 5,600,257'Semiconductor wafer test and burn-in'1997 5,546,012'Probe card assembly having a ceramic probe card'1996 5,532,608'Ceramic probe card and method for reducing leakage current'1996 5,530,371'Probe card assembly'1996 5,398,923'One-way winch brake'1995 5,293,504'Multilayer ceramic substrate with capped vias'1994 5,277,725'Process for fabricating a low dielectric composite substrate'1994 5,260,519'Multilayer ceramic substrate with graded vias'1993 5,139,852'Low dielectric composite substrate'1992 5,135,595'Process for fabricating a low dielectric composite substrate'1992 5,130,067'Method and means for co-sintering ceramic/metal MLC substrates'1992 4,937,930'Method for forming a defect-free surface on a porous ceramic substrate'1990 4,781,970'Strengthening a ceramic by post sinter coating with a compressive surface layer'1988 4,684,339'Gas-loaded pressure diaphragm'1987 4,519,851'Method for providing pinhole free dielectric layers'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1985–2007Patents assigned to IBM (40)· patent assignee history

1985–2007Based in Poughkeepsie, NY, US· patent location history

1995Patents assigned to SUPERWINCH INC (1)· patent assignee history

1995Based in Putnam, CT, US· patent location history

2012–2021Patents assigned to PERRY CHARLES HAMPTON (7)· patent assignee history

2012–2016Patents assigned to MARTIN III PAUL WALTER (4)· patent assignee history

2012–2021Based in Murfreesboro, TN, US· patent location history

2014Based in Murfreesbobo, TN, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	40	1985–2007
PERRY CHARLES HAMPTONself	7	2012–2021
MARTIN III PAUL WALTER	4	2012–2016
SUPERWINCH INC	1	1995

Locations

Location	Patents	Span
Poughkeepsie, New York, US	40	1985–2007
Murfreesboro, TN, US	6	2012–2021
Murfreesbobo, TN, US	1	2014
Putnam, CT, US	1	1995