Inventor
KYU OH LEE
Inventor
US
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices29%
H01FMagnets13%
H10DInorganic electric semiconductor devices10%
H05KPrinted circuits7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
H10NElectric solid-state devices not otherwise provided for2%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%
C22CAlloys1%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact1%
PatentTitleYear
12,592,334Stacked magnetic inductor and method202612,555,714Device, method, and system to provide passivation structures of a magnetic material based inductor202612,327,773Package with underfill containment barrier202512,288,744Microelectronic assemblies having conductive structures with different thicknesses on a core substrate202512,224,264Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate202512,224,253Magnetic inductor device and method202512,154,715Methods to selectively embed magnetic materials in substrate and corresponding structures202411,942,406Semiconductor packages with embedded interconnects202411,935,805Package with underfill containment barrier202411,901,115Substrate assembly with encapsulated magnetic feature202411,862,552Methods of embedding magnetic structures in substrates202411,842,981Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate202311,735,537Methods to embed magnetic material as first layer on coreless substrates and corresponding structures202311,664,290Package with underfill containment barrier202311,651,885Magnetic core inductors202311,610,706Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates202311,581,271Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate202311,557,489Cavity structures in integrated circuit package supports202311,521,914Microelectronic assemblies having a cooling channel202211,502,017Effective heat conduction from hotspot to heat spreader through package substrate202211,482,471Thermal management solutions for integrated circuit packages202211,450,471Methods to selectively embed magnetic materials in substrate and corresponding structures202211,443,892Substrate assembly with encapsulated magnetic feature202211,432,405Methods for attaching large components in a package substrate for advanced power delivery202211,417,614Methods to embed magnetic material as first layer on coreless substrates and corresponding structures202211,410,921Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films202211,393,745Semiconductor packages with embedded interconnects202211,387,224Phase change material in substrate cavity202211,380,609Microelectronic assemblies having conductive structures with different thicknesses on a core substrate202211,355,459Embedding magnetic material, in a cored or coreless semiconductor package202211,322,290Techniques for an inductor at a first level interface202211,276,634High density package substrate formed with dielectric bi-layer202211,251,113Methods of embedding magnetic structures in substrates202211,244,912Semiconductor package having a coaxial first layer interconnect202211,217,534Galvanic corrosion protection for semiconductor packages202211,158,558Package with underfill containment barrier202111,139,264Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (37)· patent assignee history
2021–2026Based in US· patent location history
2022Patents assigned to INTEL CORPOATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 37 | 2021–2026 |
| INTEL CORPOATION | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 37 | 2021–2026 |