Inventor
GLENN RINNE
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
PatentTitleYear
12,362,343Semiconductor device using EMC wafer support system and fabricating method thereof202512,327,812Semiconductor device and manufacturing method thereof202512,205,827Electronic device with top side pin array and manufacturing method thereof202511,916,033Method and system for packing optimization of semiconductor devices202411,901,332Semiconductor device and manufacturing method thereof202411,239,192Method and system for packing optimization of semiconductor devices202211,183,493Semiconductor device using EMC wafer support system and fabricating method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (7)· patent assignee history
2021–2025Based in US· patent location history
2022Patents assigned to AMKOR TECH SINGAPORE PTE LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 7 | 2021–2025 |
| AMKOR TECH SINGAPORE PTE LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2021–2025 |