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Inventor

Taek Jung Lee

Inventor
Suwon-si, KR

Overview

22→
Patents
2008–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Gprimary
H01GCapacitors37%
H05KPrinted circuits21%
Y02PClimate change mitigation technologies in the production or processing of goods12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
C04BLime, magnesia7%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
H01BCables2%
H01LSemiconductor devices2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,840,016Capacitor component202010,818,435Capacitor component202010,763,041Multilayer ceramic capacitor and method of manufacturing the same202010,629,378Multilayer capacitor202010,617,008Capacitor and board having the same202010,580,579Multilayer ceramic capacitor and method of manufacturing the same202010,573,462Capacitor component202010,562,818Insulator composition and manufacturing method using the same202010,559,424Multilayer capacitor and board having the same202010,559,425Multilayer capacitor and board having the same202010,468,190Capacitor component201910,373,760Capacitor component201910,319,522Multilayer ceramic capacitor and method for manufacturing the same201910,269,496Multilayer capacitor and board having the same201910,186,380Capacitor component201910,026,558Multilayer capacitor and board having the same mounted thereon20189,974,173Multilayer ceramic substrate and manufacturing thereof20189,101,064'Thin film electrode ceramic substrate and method for manufacturing the same'20158,106,306'Ceramic multi-layer circuit substrate and manufacturing method thereof'20128,012,778'LED package and fabricating method thereof'20117,819,995'Manufacturing method of multi-layer ceramic substrate'20107,453,093'LED package and fabricating method thereof'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2020Patents assigned to SAMSUNG ELECTRO MECH (21)· patent assignee history
2008–2012Based in Kyungki-do, KR· patent location history
2012–2015Patents assigned to CHANG BYEUNG GYU (2)· patent assignee history
2012–2015Patents assigned to LEE TAEK JUNG (2)· patent assignee history
2012–2015Patents assigned to YOO WON HEE (2)· patent assignee history
2012Patents assigned to KIM YONG SUK (1)· patent assignee history
2015Based in Gyeonggi-do, KR· patent location history
2018–2020Based in Suwon-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRO MECH212008–2020
CHANG BYEUNG GYU22012–2015
LEE TAEK JUNGself22012–2015
YOO WON HEE22012–2015
KIM YONG SUK12012
Locations
LocationPatentsSpan
Suwon-si, KR172018–2020
Kyungki-do, KR42008–2012
Gyeonggi-do, KR12015