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Inventor

Toshiyuki Hata

Inventor
Maebashi, JP

Overview

58→
Patents
1994–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 58 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
H10DInorganic electric semiconductor devices22%
H05KPrinted circuits9%
H01GCapacitors5%
H01LSemiconductor devices5%
H04NPictorial communication, e.g. television2%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers2%
G09BEducational or demonstration appliances1%
G10GRepresentation of music1%
G10HElectrophonic musical instruments1%
PatentTitleYear
10,818,581Method of manufacturing semiconductor device and semiconductor device202010,332,496Reference display device, reference display method, and program20199,824,996'Semiconductor device having low on resistance'20179,432,767'Headphone with microphones that processes external sound pickup by the microphones and inputs external source sound signal'20169,165,901'Semiconductor device'20159,129,946'Semiconductor device'20158,981,538'Semiconductor device and a method for manufacturing a semiconductor device'20158,816,411'Mosfet package'20148,811,626'Recording/reproducing apparatus'20148,796,838'Semiconductor device'20148,698,289'Semiconductor device, a method of manufacturing the same and an electronic device'20148,629,467'Semiconductor device'20148,536,687'Semiconductor device having separated heatsink and chip mounting portion'20138,455,986'Mosfet package'20138,304,890'Semiconductor device'20128,222,651'Semiconductor device'20128,183,607'Semiconductor device'20128,138,600'Semiconductor device and method of manufacturing the same'20128,022,518'Semiconductor device having a sealing body and partially exposed conductors'20117,985,991'MOSFET package'20117,955,902'Manufacturing method of semiconductor device with surface mounting terminals'20117,812,464'Semiconductor device and a method of manufacturing for high output MOSFET'20107,800,215'Semiconductor device'20107,763,967'Semiconductor device with surface mounting terminals'20107,728,416'Semiconductor device, a method of manufacturing the same and an electronic device'20107,688,478'Image processing apparatus, image processing method, and program for implementing the method'20107,667,307'Semiconductor device'20107,586,180'Semiconductor packaging device comprising a semiconductor chip including a MOSFET'20097,541,672'Semiconductor device'20097,432,594'Semiconductor chip, electrically connections therefor'20087,408,251'Semiconductor packaging device comprising a semiconductor chip including a MOSFET'20087,400,002'MOSFET package'20087,394,146'MOSFET package'20087,385,279'Semiconductor device and a method of manufacturing the same'20087,342,267'MOSFET package'20087,342,307'Semiconductor device'20087,332,757'MOSFET package'20087,319,493'Apparatus and program for setting video processing parameters'20087,173,333'Semiconductor device'20077,160,760'Semiconductor device and a method of manufacturing the same'20077,084,491'Semiconductor device'20066,992,385'Semiconductor device, a method of manufacturing the same and an electronic device'20066,992,386'Semiconductor device and a method of manufacturing the same'20066,882,047'Semiconductor package including a plurality of semiconductor chips therein'20056,839,223'Capacitor'20056,812,554'Semiconductor device and a method of manufacturing the same'20046,774,466'Semiconductor device'20046,768,632'Aluminum electrolytic capacitor and method of manufacturing the same'20046,711,000'Aluminum electrolytic capacitor and process of producing the same'20046,573,119'Semiconductor device and method of manufacture thereof'20036,492,739'Semiconductor device having bumper portions integral with a heat sink'20026,479,888'Semiconductor device and a method of manufacturing the same'20026,392,308'Semiconductor device having bumper portions integral with a heat sink'20026,320,270'Semiconductor device and method of producing the same'20016,310,756'Capacitor'20016,104,085'Semiconductor device and method of producing the same'20005,808,359'Semiconductor device having a heat sink with bumpers for protecting outer leads'19985,366,515'Method of electrically aging an electronic component'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2005Based in Uji, JP· patent location history
1998–2013Patents assigned to HITACHI TOBU SEMICONDUCTOR LTD (12)· patent assignee history
1998–2003Patents assigned to HITACHI LTD (7)· patent assignee history
1998–2014Based in Maebashi, JP· patent location history
2004–2010Patents assigned to RENESAS TECH CORP (20)· patent assignee history
2008–2019Based in Hamamatsu, JP· patent location history
2010–2020Patents assigned to RENESAS ELECTRONICS CORP (19)· patent assignee history
2010–2020Based in Tokyo, JP· patent location history
2012–2016Patents assigned to HATA TOSHIYUKI (10)· patent assignee history
2014–2017Based in Kawasaki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS TECH CORP202004–2010
RENESAS ELECTRONICS CORP192010–2020
HITACHI TOBU SEMICONDUCTOR LTD121998–2013
HATA TOSHIYUKIself102012–2016
HITACHI LTD71998–2003
Locations
LocationPatentsSpan
Maebashi, JP371998–2014
Tokyo, JP52010–2020
Hamamatsu, JP52008–2019
Kawasaki, JP42014–2017
Uji, JP41994–2005