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Inventor

Cenk Acar

Inventor
Irvine, CA, US

Overview

39→
Patents
2005–2021
Patent span
Physics
Primary field (CPC G)

Patents· 39 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Cprimary
G01CMeasuring distances, levels or bearings22%
B81BMicrostructural devices or systems, e.g. micromechanical devices17%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock16%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H01LSemiconductor devices6%
Y10TTechnical subjects covered by former us classification6%
H10NElectric solid-state devices not otherwise provided for6%
H10DInorganic electric semiconductor devices3%
H05KPrinted circuits1%
PatentTitleYear
11,085,766Micromachined multi-axis gyroscopes with reduced stress sensitivity202110,697,994Accelerometer techniques to compensate package stress202010,393,770Multi-axis accelerometer with reduced stress sensitivity201910,050,155Micromachined monolithic 3-axis gyroscope with single drive20189,856,132'Sealed packaging for microelectromechanical systems'20189,605,965'Micromachined piezoelectric x-axis gyroscope'20179,599,472'MEMS proof mass with split Z-axis portions'20179,586,813'Multi-die MEMS package'20179,459,099'Micromachined piezoelectric x-axis gyroscope'20169,455,354'Micromachined 3-axis accelerometer with a single proof-mass'20169,410,805'Micromachined piezoelectric z-axis gyroscope'20169,352,961'Flexure bearing to reduce quadrature for resonating micromachined devices'20169,278,845'MEMS multi-axis gyroscope Z-axis electrode structure'20169,278,846'Micromachined monolithic 6-axis inertial sensor'20169,246,018'Micromachined monolithic 3-axis gyroscope with single drive'20169,156,673'Packaging to reduce stress on microelectromechanical systems'20159,095,072'Multi-die MEMS package'20159,062,972'MEMS multi-axis accelerometer electrode structure'20159,021,880'Micromachined piezoelectric three-axis gyroscope and stacked lateral overlap transducer (slot) based three-axis accelerometer'20159,006,846'Through silicon via with reduced shunt capacitance'20159,000,656'Microelectromechanical system device including a metal proof mass and a piezoelectric component'20158,978,475'MEMS proof mass with split z-axis portions'20158,813,564'MEMS multi-axis gyroscope with central suspension and gimbal structure'20148,739,626'Micromachined inertial sensor devices'20148,710,599'Micromachined devices and fabricating the same'20148,584,522'Micromachined piezoelectric x-axis gyroscope'20138,516,886'Micromachined piezoelectric X-Axis gyroscope'20138,516,887'Micromachined piezoelectric z-axis gyroscope'20138,113,050'Robust six degree-of-freedom micromachined gyroscope with anti-phase drive scheme and method of operation of the same'20127,461,552'Dual axis rate sensor'20087,421,898'Torsional nonresonant z-axis micromachined gyroscope with non-resonant actuation to measure the angular rotation of an object'20087,377,167'Nonresonant micromachined gyroscopes with structural mode-decoupling'20087,284,430'Robust micromachined gyroscopes with two degrees of freedom sense-mode oscillator'20077,279,761'Post-release capacitance enhancement in micromachined devices and a method of performing the same'20077,240,552'Torsional rate sensor with momentum balance and mode decoupling'20077,228,738'Torsional rate sensor with momentum balance and mode decoupling'20077,222,533'Torsional rate sensor with momentum balance and mode decoupling'20077,100,446'Distributed-mass micromachined gyroscopes operated with drive-mode bandwidth enhancement'20066,845,669'Non-resonant four degrees-of-freedom micromachined gyroscope'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2012Patents assigned to UNIV CALIFORNIA (7)· patent assignee history
2005–2017Based in Irvine, CA, US· patent location history
2012–2018Patents assigned to ACAR CENK (18)· patent assignee history
2013–2017Patents assigned to QUALCOMM MEMS TECHNOLOGIES INC (8)· patent assignee history
2014–2018Patents assigned to FAIRCHILD SEMICONDUCTOR (17)· patent assignee history
2015–2018Patents assigned to BLOOMSBURGH JOHN GARDNER (6)· patent assignee history
2015–2020Based in Newport Coast, CA, US· patent location history
2019–2021Based in Santa Clara, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ACAR CENKself182012–2018
FAIRCHILD SEMICONDUCTOR172014–2018
QUALCOMM MEMS TECHNOLOGIES INC82013–2017
UNIV CALIFORNIA72005–2012
BLOOMSBURGH JOHN GARDNER62015–2018
Locations
LocationPatentsSpan
Irvine, California, US272005–2017
Newport Coast, California, US102015–2020
Santa Clara, California, US22019–2021