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Inventor

Kotaro MASUYAMA

Inventor
JP

Overview

3→
Patents
2022–2025
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder27%
B23KSoldering or unsoldering18%
H01BCables18%
H01LSemiconductor devices9%
H05KPrinted circuits9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Y10TTechnical subjects covered by former us classification9%
PatentTitleYear
12,226,820Bonding sheet202511,587,695Silver powder, paste composition, and method of producing silver powder202311,257,735Heat sink-equipped power module substrate and manufacturing method for heat sink-equipped power module substrate2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to MITSUBISHI MATERIALS CORP (3)· patent assignee history
2022–2025Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI MATERIALS CORP32022–2025
Locations
LocationPatentsSpan
JP32022–2025