Inventor
CHUN-HSU CHEN
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
H10DInorganic electric semiconductor devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G06FElectric digital data processing13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
F23GCremation furnaces6%
G05BControl or regulating systems in general6%
H10BElectronic memory devices6%
PatentTitleYear
12,432,914Non-volatile memory structure and method for forming the same202512,027,413Semiconductor structure and method of fabricating the same202411,742,295Interface of integrated circuit die and method for arranging interface thereof202311,609,559Data processing system and method202311,211,331Semiconductor structure having a via and methods of manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to VANGUARD INT SEMICONDUCT CORP (2)· patent assignee history
2021–2025Based in TW· patent location history
2023Patents assigned to GLOBAL UNICHIP CORP (1)· patent assignee history
2023Patents assigned to IND TECH RES INST (1)· patent assignee history
2023Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2025Patents assigned to WINBOND ELECTRONICS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VANGUARD INT SEMICONDUCT CORP | 2 | 2021–2024 |
| GLOBAL UNICHIP CORP | 1 | 2023 |
| IND TECH RES INST | 1 | 2023 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 1 | 2023 |
| WINBOND ELECTRONICS CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2021–2025 |