Inventor
Mathew MANUSHAROW
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01FMagnets16%
H01PWaveguides11%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices11%
G06FElectric digital data processing5%
H01GCapacitors5%
PatentTitleYear
12,224,252Magnetic core inductors in interposer202511,791,528Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line202311,688,729Integrated thin film capacitors on a glass core substrate202311,527,489Apparatus and system with package stiffening magnetic inductor core and methods of making the same202211,437,346Package structure having substrate thermal vent structures for inductor cooling202211,329,358Low loss and low cross talk transmission lines having l-shaped cross sections2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (6)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2025 |