Inventor
Hsiu-Wen Tu
Inventor
Hsinchu County, TW
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H01LSemiconductor devices18%
H04NPictorial communication, e.g. television4%
Y10TTechnical subjects covered by former us classification2%
B81BMicrostructural devices or systems, e.g. micromechanical devices1%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems1%
PatentTitleYear
10,964,615Chip-scale sensor package structure202110,825,851Sensor package structure202010,720,370Sensor package structure202010,700,111Optical sensor202010,692,917Sensor package structure202010,600,830Sensor package structure202010,340,250Stack type sensor package structure201910,236,313Sensor package structure201910,186,538Sensor package structure201910,170,508Optical package structure20199,184,331'Method for reducing tilt of optical unit during manufacture of image sensor'20158,969,120'Two-stage packaging method of image sensors'20158,928,104'Image sensor packaging structure with black encapsulant'20158,847,146'Image sensor package structure with casing including a vent without sealing and in communication with package material'20148,828,777'Wafer level image sensor packaging structure and manufacturing method of the same'20148,703,519'Structure and manufacturing method for high resolution camera module'20148,563,350'Wafer level image sensor packaging structure and manufacturing method for the same'20138,481,343'Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same'20138,441,086'Image sensor packaging structure with predetermined focal length'20138,440,488'Manufacturing method and structure for wafer level image sensor module with fixed focal length'20138,390,087'Image sensor package structure with large air cavity'20138,378,441'Manufacturing method and structure of a wafer level image sensor module with package structure'20138,093,674'Manufacturing method for molding image sensor package structure and image sensor package structure thereof'20127,554,599'Image sensor module with air escape hole and a method for manufacturing the same'20097,423,334'Image sensor module with a protection layer and a method for manufacturing the same'20086,874,227'Method for packaging an image sensor'20056,870,208'Image sensor module'20056,737,720'Packaging structure of image sensor and method for packaging the same'20046,696,738'Miniaturized image sensor'20046,646,316'Package structure of an image sensor and packaging'20036,627,983'Stacked package structure of image sensor'20036,590,269'Package structure for a photosensitive chip'20036,565,008'Module card and a method for manufacturing the same'20036,559,539'Stacked package structure of image sensor'20036,521,881'Stacked structure of an image sensor and method for manufacturing the same'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2021Patents assigned to KINGPAK TECH INC (32)· patent assignee history
2003–2021Based in Hsinchu County, TW· patent location history
2003Based in Hsin Chu Hsien, TW· patent location history
2012–2015Patents assigned to HSIN CHUNG-HSIEN (10)· patent assignee history
2012–2015Patents assigned to TU HSIU-WEN (10)· patent assignee history
2012–2015Patents assigned to KUO REN-LONG (8)· patent assignee history
2012–2015Patents assigned to SHIAO YOUNG-HOUNG (8)· patent assignee history
2012–2014Based in Jhubei City, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KINGPAK TECH INC | 32 | 2003–2021 |
| HSIN CHUNG-HSIEN | 10 | 2012–2015 |
| TU HSIU-WENself | 10 | 2012–2015 |
| KUO REN-LONG | 8 | 2012–2015 |
| SHIAO YOUNG-HOUNG | 8 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 32 | 2003–2021 |
| Jhubei City, TW | 2 | 2012–2014 |
| Hsin Chu Hsien, TW | 1 | 2003 |