Inventor
BENJAMIN DAVID BRIGGS
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,550,709Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device202612,033,892Structure and method to improve FAV RIE process margin and electromigration202411,955,424Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device202411,710,658Structure and method to improve FAV RIE process margin and Electromigration2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2024Patents assigned to TESSERA LLC (2)· patent assignee history
2023–2026Based in US· patent location history
2024–2026Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADEIA SEMICONDUCTOR SOLUTIONS LLC | 2 | 2024–2026 |
| TESSERA LLC | 2 | 2023–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2023–2026 |