Inventor
Mark Thomas McCormack
Inventor
Summit, NJ, US
Overview
Patents· 42 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y10TTechnical subjects covered by former us classification11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B23KSoldering or unsoldering5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B82YSpecific uses or applications of nanostructures3%
C22CAlloys3%
G01RMeasuring electric variables3%
G06FElectric digital data processing3%
PatentTitleYear
10,910,281Integrated circuit metallic ion diffusion defect validation20219,661,770'Graphic formation via material ablation'20179,563,233'Electronic device with plated electrical contact'20177,513,037'Method of embedding components in multi-layer circuit boards'20097,386,197'Method and apparatus for wafer level testing of integrated optical waveguide circuits'20087,199,307'Structure and method for embedding capacitors in z-connected multi-chip modules'20076,882,045'Multi-chip module and method for forming and method for deplating defective capacitors'20056,866,741'Method for joining large substrates'20056,859,587'Method and apparatus for wafer level testing of integrated optical waveguide circuits'20056,759,257'Structure and method for embedding capacitors in z-connected multi-chip modules'20046,684,007'Optical coupling structures and the fabrication processes'20046,669,801'Device transfer method'20036,603,915'Interposer and method for producing a light-guiding structure'20036,579,474'Conductive composition'20036,572,780'Methods for fabricating flexible circuit structures'20036,544,430'Methods for detaching a layer from a substrate'20036,521,530'Composite interposer and method for producing a composite interposer'20036,428,942'Multilayer circuit structure build up method'20026,326,555'Method and structure of z-connected laminated substrate for high density electronic packaging'20016,281,040'Methods for making circuit substrates and electrical assemblies'20016,271,107'Semiconductor with polymeric layer'20016,163,957'Multilayer laminated substrates with high density interconnects and methods of making the same'20006,054,761'Multi-layer circuit substrates and electrical assemblies having conductive composition connectors'20005,846,366'Method for interconnecting an electronic device using a transferable solder carrying medium'19985,834,709'Position sensing systems including magnetoresistive elements'19985,762,866'Article comprising a Pb-free solder having improved mechanical properties'19985,747,918'Display apparatus comprising diamond field emitters'19985,698,160'Lead-free alloys for use in solder bonding'19975,618,189'Solder medium for circuit interconnection'19975,591,037'Method for interconnecting an electronic device using a removable solder carrying medium'19975,569,433'Lead-free low melting solder with improved mechanical properties'19965,560,752'Process for activation of metal hydrides'19965,549,977'Article comprising magnetoresistive material'19965,538,800'Magnetoresistive oxide material and articles comprising the material'19965,538,686'Article comprising a PB-free solder having improved mechanical properties'19965,512,818'Voltage proportional replication device using magnetoresistive sensing elements'19965,509,815'Solder medium for circuit interconnection'19965,461,308'Magnetoresistive current sensor having high sensitivity'19955,450,372'Magnetoresistive microphone and acoustic sensing devices'19955,411,814'Article comprising magnetoresistive oxide of La, Ca, Mn additionally containing either of both of Sr and Ba'19955,346,775'Article comprising solder with improved mechanical properties'19945,328,550'Thinning a diamond body by means of molten rare-earth-containing alloys'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–1998Based in Summit, NJ, US· patent location history
1995–1996Patents assigned to AT & T CORP (7)· patent assignee history
1996–1998Patents assigned to LUCENT TECHNOLOGIES INC (10)· patent assignee history
2000–2009Patents assigned to FUJITSU LTD (17)· patent assignee history
2000–2003Based in San Jose, CA, US· patent location history
2003–2021Based in Livermore, CA, US· patent location history
2005–2008Patents assigned to INTEL CORP (2)· patent assignee history
2017–2021Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 17 | 2000–2009 |
| LUCENT TECHNOLOGIES INC | 10 | 1996–1998 |
| AT & T CORP | 7 | 1995–1996 |
| MICROSOFT TECHNOLOGY LICENSING LLC | 3 | 2017–2021 |
| INTEL CORP | 2 | 2005–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Summit, New Jersey, US | 19 | 1994–1998 |
| Livermore, California, US | 16 | 2003–2021 |
| San Jose, California, US | 7 | 2000–2003 |