Inventor
Yuji TOTOKI
Inventor
JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
12,581,984Apparatus and methods for bonding pad redistribution layers in integrated circuits202612,408,345Three-dimensional memory device with backside support pillar structures and methods of forming the same202511,943,922Non-volatile memory with three dimensional stacked word line switches202411,844,222Three-dimensional memory device with backside support pillar structures and methods of forming the same202311,637,038Three-dimensional memory device containing self-aligned lateral contact elements and methods for forming the same202311,488,975Multi-tier three-dimensional memory device with nested contact via structures and methods for forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SANDISK TECHNOLOGIES LLC (4)· patent assignee history
2022–2025Based in JP· patent location history
2024Patents assigned to WESTERN DIGITAL TECH INC (1)· patent assignee history
2024–2026Based in US· patent location history
2025–2026Patents assigned to SANDISK TECHNOLOGIES INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDISK TECHNOLOGIES LLC | 4 | 2022–2025 |
| SANDISK TECHNOLOGIES INC | 2 | 2025–2026 |
| WESTERN DIGITAL TECH INC | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2025 |
| US | 2 | 2024–2026 |