Inventor
Jae Hak Yee
Inventor
Singapore, SG
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1064%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H01LSemiconductor devices7%
Y10TTechnical subjects covered by former us classification7%
A47CChairs4%
H05KPrinted circuits2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
PatentTitleYear
9,202,776'Stackable multi-chip package system'20158,946,878'Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor'20158,937,372'Integrated circuit package system with molded strip protrusion'20158,847,413'Integrated circuit package system with leads having multiple sides exposed'20148,810,019'Integrated circuit package system with stacked die'20148,581,382'Integrated circuit packaging system with leadframe and method of manufacture thereof'20138,501,540'Method for manufacture of inline integrated circuit system'20138,471,374'Integrated circuit package system with L-shaped leadfingers'20138,432,026'Stackable multi-chip package system'20138,207,015'Integrated circuit packaging system with package-on-package and method of manufacture thereof'20128,138,591'Integrated circuit package system with stacked die'20128,067,272'Integrated circuit package system for package stacking and manufacturing method thereof'20118,018,039'Integrated circuit package system with stacked devices'20117,968,981'Inline integrated circuit system'20117,915,738'Stackable multi-chip package system with support structure'20117,645,638'Stackable multi-chip package system with support structure'20107,622,333'Integrated circuit package system for package stacking and manufacturing method thereof'20097,564,122'Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant'20097,057,280'Leadframe having lead locks to secure leads to encapsulant'20066,953,988'Semiconductor package'20056,876,069'Ground plane for exposed package'20056,858,919'Semiconductor package'20056,825,062'Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant'20046,759,737'Semiconductor package including stacked chips with aligned input/output pads'20046,686,258'Method of trimming and singulating leaded semiconductor packages'20046,677,663'End grid array semiconductor package'20046,646,339'Thin and heat radiant semiconductor package and method for manufacturing'20036,630,373'Ground plane for exposed package'20036,627,976'Leadframe for semiconductor package and mold for molding the same'20036,555,899'Semiconductor package leadframe assembly and method of manufacture'20036,525,406'Semiconductor device having increased moisture path and increased solder joint strength'20036,521,987'Plastic integrated circuit device package and method for making the package'20036,483,177'Leaded semiconductor packages and method of trimming and singulating such packages'20026,455,356'Methods for moding a leadframe in plastic integrated circuit devices'20026,448,633'Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant'20026,281,568'Plastic integrated circuit device package and leadframe having partially undercut leads and die pad'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2009Patents assigned to AMKOR TECHNOLOGY INC (14)· patent assignee history
2001–2009Based in Seoul, KR· patent location history
2002–2015Based in Singapore, SG· patent location history
2003Based in S.K. Mansion, SG· patent location history
2004Based in Sam-Kiang Mansion, SG· patent location history
2009–2015Patents assigned to STATS CHIPPAC LTD (17)· patent assignee history
2011–2015Patents assigned to YEE JAE HAK (12)· patent assignee history
2011–2015Based in Shanghai, CN· patent location history
2012–2014Patents assigned to JANG BYOUNG WOOK (4)· patent assignee history
2012–2015Patents assigned to MYUNG JUNWOO (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 17 | 2009–2015 |
| AMKOR TECHNOLOGY INC | 14 | 2001–2009 |
| YEE JAE HAKself | 12 | 2011–2015 |
| JANG BYOUNG WOOK | 4 | 2012–2014 |
| MYUNG JUNWOO | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 16 | 2002–2015 |
| Shanghai, CN | 11 | 2011–2015 |
| Seoul, KR | 7 | 2001–2009 |
| Sam-Kiang Mansion, SG | 1 | 2004 |
| S.K. Mansion, SG | 1 | 2003 |