LexDanaLexDanabeta
Inventor

Tom Grebs

Inventor
Bethlehem, PA, US

Overview

3→
Patents
2017–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
10,121,716Silicon package for embedded semiconductor chip and power converter201810,062,624Silicon package for embedded semiconductor chip and power converter20189,721,860'Silicon package for embedded semiconductor chip and power converter'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2018Patents assigned to TEXAS INSTRUMENTS INC (3)· patent assignee history
2017–2018Based in Bethlehem, PA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TEXAS INSTRUMENTS INC32017–2018
Locations
LocationPatentsSpan
Bethlehem, Pennsylvania, US32017–2018