Inventor
WEI-CHUNG CHANG
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H01QAntennas, i.e. radio aerials6%
H02HEmergency protective circuit arrangements6%
H03KPulse technique6%
PatentTitleYear
12,512,440Semiconductor structure, stacked structure with terminal comprising capping layer and manufacturing method thereof202512,362,486Antenna structure202512,322,682Semiconductor package having composite seed-barrier layer and method of forming the same202512,191,203Semiconductor package202511,901,230Semiconductor package and manufacturing method thereof202411,823,981Semiconductor package and manufacturing method thereof202311,146,056Interface control circuit and control method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to RICHTEK TECHNOLOGY CORP (1)· patent assignee history
2021–2025Based in TW· patent location history
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2025Patents assigned to WISTRON NEWEB CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2023–2025 |
| RICHTEK TECHNOLOGY CORP | 1 | 2021 |
| WISTRON NEWEB CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2021–2025 |