Inventor

MIRNG-JI LII

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 62 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices34%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%

H10DInorganic electric semiconductor devices5%

H10KOrganic electric solid-state devices2%

Y02PClimate change mitigation technologies in the production or processing of goods2%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%

H01FMagnets1%

H10BElectronic memory devices1%

H10HInorganic light-emitting semiconductor devices having potential barriers1%

PatentTitleYear

12,598,995Semiconductor device and method of forming same2026 12,581,935Stacked via structures and methods for forming the same2026 12,550,710Semiconductor die2026 12,538,836Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming same2026 12,532,738Chip package structure with heat conductive layer2026 12,532,789Package structure with cavity substrate2026 12,525,556Semiconductor devices and methods of manufacture2026 12,519,055Stacking via configuration for advanced silicon node products and methods for forming the same2026 12,494,379Heterogeneous bonding structure and method forming same2025 12,482,766MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the same2025 12,482,790Packages with stacked dies and methods of forming the same2025 12,476,211Semiconductor device2025 12,463,150Bonding structures in semiconductor packaged device and method of forming same2025 12,243,681Programmable inductor and methods of manufacture2025 12,237,320Package structure and method of forming the same2025 12,230,595Metal bumps and method forming same2025 12,136,644Process for tuning via profile in dielectric material2024 12,087,648Seal ring structure with zigzag patterns and method forming same2024 12,068,303Package structure2024 12,062,586Semiconductor device structure with magnetic element2024 12,051,632Semiconductor package structure and method for forming semiconductor package structure2024 12,027,435Packages including multiple encapsulated substrate blocks and overlapping redistribution structures2024 12,021,048Semiconductor device2024 12,009,327Semiconductor die2024 11,990,428Bonding structures in semiconductor packaged device and method of forming same2024 11,967,579Method for forming package structure with cavity substrate2024 11,961,944Semiconductor device and manufacturing method thereof2024 11,942,445Semiconductor device with conductive pad2024 11,908,818Semiconductor device2024 11,901,266Semiconductor device structure and method for forming the same2024 11,894,241Heterogeneous bonding structure and method forming same2024 11,855,058Package structure and method of forming the same2023 11,854,835Heterogeneous bonding structure and method forming same2023 11,848,270Chip structure and method for forming the same2023 11,842,935Method for forming a reconstructed package substrate comprising substrates blocks2023 11,824,026Connector structure and method of forming same2023 11,812,646Display device and manufacturing method thereof2023 11,756,731Programmable inductor2023 11,742,204Multi-layer structures and methods of forming2023 11,728,217Wafer level package structure and method of forming same2023 11,652,086Packages with stacked dies and methods of forming the same2023 11,631,621Semiconductor device structure with magnetic element2023 11,594,484Forming bonding structures by using template layer as templates2023 11,569,419Semiconductor device and manufacturing method thereof2023 11,532,692Process for tuning via profile in dielectric material2022 11,532,583Semiconductor structure and manufacturing method thereof2022 11,476,125Multi-die package with bridge layer2022 11,462,509Package structure with electronic device in cavity substrate and method for forming the same2022 11,450,588Method for forming chip package structure with heat conductive layer2022 11,417,610Post-passivation interconnect structure2022 11,393,771Bonding structures in semiconductor packaged device and method of forming same2022 11,342,291Semiconductor packages with crack preventing structure2022 11,315,896Conical-shaped or tier-shaped pillar connections2022 11,264,342Package on package structure and method for forming the same2022 11,244,919Package structure and method of fabricating the same2022 11,239,305Display device and manufacturing method thereof2022 11,222,859Semiconductor device structure with bonding pad and method for forming the same2022 11,211,261Package structures and methods for forming the same2021 11,177,228Semiconductor device and bump formation process2021 11,177,355Semiconductor structure and manufacturing method thereof2021 11,158,614Thermal performance structure for semiconductor packages and method of forming same2021 11,152,344Integrated circuit package and methods of forming same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (62)· patent assignee history

2021–2026Based in TW· patent location history

2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	62	2021–2026
TAIWAN SEMICONDUCTOR MFG COMPANY LTD	1	2026

Locations

Location	Patents	Span
TW	62	2021–2026