Inventor
Huai HUANG
Inventor
US
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H01LSemiconductor devices23%
G01SRadio direction-finding7%
H10DInorganic electric semiconductor devices6%
A61KPreparations for medical, dental or toiletry purposes5%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations5%
C07DHeterocyclic compounds5%
G02BOptical elements, systems or apparatus5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B23KSoldering or unsoldering2%
PatentTitleYear
12,598,983Interconnects formed using integrated damascene and subtractive etch processing202612,575,400Power planes and pass-through vias202612,550,709Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device202612,550,713Hybrid buried power rail structure with dual front side and backside processing202612,538,553Contact structure for power delivery on semiconductor device202612,494,428Airgap spacer for power via202512,459,917Salt of diaminopyrimidine compounds, and solid form thereof, preparation method therefor and use thereof202512,424,557Dual structured buried rail202512,424,549Skip-level TSV with hybrid dielectric scheme for backside power delivery202512,412,836Backside power plane202512,392,874Light detection and ranging sensors with multiple emitters and multiple receivers, and associated systems and methods202512,365,665Solid form of diaminopyrimidine compound or hydrate thereof, preparation method therefor, and application thereof202512,334,442Dielectric caps for power and signal line routing202512,298,392Scanning module, distance measuring device and mobile platform202512,261,056Top via patterning using metal as hard mask and via conductor202512,218,003Selective ILD deposition for fully aligned via with airgap202512,196,855Distance detection device202512,180,243Receptor inhibitor, pharmaceutical composition comprising same, and use thereof202412,092,737Distance detection apparatuses202411,955,424Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device202411,944,013Magnetic tunnel junction device with minimum stray field202411,905,274Receptor inhibitors, pharmaceutical compositions comprising the same and use thereof202411,802,762Laser-based measurement device and movable platform202311,756,887Backside floating metal for increased capacitance2023D0995328Lidar202311,676,854Selective ILD deposition for fully aligned via with airgap202311,621,189Barrier-less prefilled via formation202311,621,199Silicide formation for source/drain contact in a vertical transport field-effect transistor202311,574,864Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device202311,469,655Driving device, laser measurement device and movable platform202211,453,690Receptor inhibitor, pharmaceutical composition comprising same, and use thereof202211,336,074LIDAR sensor system with small form factor202211,315,827Skip via connection between metallization levels202211,244,861Method and structure for forming fully-aligned via202211,221,212Laser-based measurement device and movable platform202211,199,505Machine learning enhanced optical-based screening for in-line wafer testing202111,177,162Trapezoidal interconnect at tight BEOL pitch202111,158,543Silicide formation for source/drain contact in a vertical transport field-effect transistor202111,152,257Barrier-less prefilled via formation2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to IBM (19)· patent assignee history
2021–2026Based in US· patent location history
2022–2025Patents assigned to SZ DJI TECHNOLOGY CO LTD (9)· patent assignee history
2022–2025Patents assigned to BEIJING TIDE PHARMACEUTICAL CO LTD (5)· patent assignee history
2022–2025Based in CN· patent location history
2023Patents assigned to TESSERA LLC (2)· patent assignee history
2024–2026Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 19 | 2021–2026 |
| SZ DJI TECHNOLOGY CO LTD | 9 | 2022–2025 |
| BEIJING TIDE PHARMACEUTICAL CO LTD | 5 | 2022–2025 |
| ADEIA SEMICONDUCTOR SOLUTIONS LLC | 3 | 2024–2026 |
| TESSERA LLC | 2 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 25 | 2021–2026 |
| CN | 14 | 2022–2025 |