Inventor
Futoshi Shimai
Inventor
Kanagawa, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1036%
B05CApparatus for applying fluent materials to surfaces, in general21%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices11%
B05BSpraying apparatus8%
H01LSemiconductor devices8%
B05DProcesses for applying fluent materials to surfaces, in general4%
C11DDetergent compositions4%
B08BCleaning in general2%
F27BFurnaces, kilns, ovens or retorts in general2%
G01MTesting static or dynamic balance of machines or structures2%
PatentTitleYear
9,214,372'Substrate processing system, carrying device and coating device'20159,010,270'Coating device including substrate carrying, application and removal units'20158,919,756'Substrate processing system, carrying device, and coating device'20148,807,072'Coating device'20148,667,924'Coating device and nozzle managing method'20148,617,655'Coating device and coating method'20138,567,342'Coating device and coating method'20138,387,556'Substrate processing system'20138,189,169'Cooling apparatus and substrate treating apparatus'20127,975,997'Supporting pin'20117,943,886'Heat treatment apparatus'20117,717,295'Treatment solution supply apparatus'20107,591,900'Nozzle for supplying treatment liquid and substrate treating apparatus'20097,381,270'Slit nozzle and apparatus for supplying treatment liquid using slit nozzle'20087,158,039'Liquid leakage sensor and liquid leakage detecting system'20076,761,930'Method of coating solution on substrate surface using a slit nozzle'20046,436,472'Method of applying a coating solution to a substrate surface using a rotary coater'20026,423,139'Chemical liquid treatment apparatus'20026,117,623'Remover solvent for partial removal of photoresist layer'20006,015,467'Method of removing coating from edge of substrate'20005,972,426'Method of coating substrate with coating nozzle'19995,785,759'Rotating cup type liquid supply device'19985,769,946'Coating nozzle and coating device having coating nozzle'19985,688,411'Method of and apparatus for removing coating from edge of substrate'19975,439,519'Solution applying apparatus'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2015Patents assigned to TOKYO OHKA KOGYO CO LTD (23)· patent assignee history
1995–2012Based in Kanagawa, JP· patent location history
2000Based in Chigasaki, JP· patent location history
2004Based in Fujisawa, JP· patent location history
2012–2015Patents assigned to SHIMAI FUTOSHI (9)· patent assignee history
2013–2015Patents assigned to SAHODA TSUTOMU (8)· patent assignee history
2013–2015Patents assigned to SATO AKIHIKO (8)· patent assignee history
2013–2015Based in Kawasaki, JP· patent location history
2014–2015Patents assigned to MARUYAMA KENJI (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO OHKA KOGYO CO LTD | 23 | 1995–2015 |
| SHIMAI FUTOSHIself | 9 | 2012–2015 |
| SAHODA TSUTOMU | 8 | 2013–2015 |
| SATO AKIHIKO | 8 | 2013–2015 |
| MARUYAMA KENJI | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 15 | 1995–2012 |
| Kawasaki, JP | 8 | 2013–2015 |
| Fujisawa, JP | 1 | 2004 |
| Chigasaki, JP | 1 | 2000 |