Inventor
Bradley R. Bitz
Inventor
Boise, ID, US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01LSemiconductor devices27%
H04NPictorial communication, e.g. television9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
B29CShaping or joining of plastics5%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts5%
B29LIndexing scheme associated with subclass b29c, relating to particular articles5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
11,004,828Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices202110,916,487Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant202110,804,256Semiconductor die assemblies having molded underfill structures and related technology202010,424,531Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant201910,074,633Semiconductor die assemblies having molded underfill structures and related technology20189,960,150Semiconductor device assembly with through-mold cooling channel formed in encapsulant20188,709,878'Methods of packaging imager devices and optics modules, and resulting assemblies'20148,110,884'Methods of packaging imager devices and optics modules, and resulting assemblies'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2021Patents assigned to MICRON TECHNOLOGY INC (8)· patent assignee history
2012–2014Patents assigned to BITZ BRADLEY (2)· patent assignee history
2012–2014Patents assigned to BOLKEN TODD (2)· patent assignee history
2012–2014Patents assigned to WILLMORTH SCOTT (2)· patent assignee history
2012–2021Based in Boise, ID, US· patent location history
2018Based in Bosie, ID, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 8 | 2012–2021 |
| BITZ BRADLEYself | 2 | 2012–2014 |
| BOLKEN TODD | 2 | 2012–2014 |
| WILLMORTH SCOTT | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 7 | 2012–2021 |
| Bosie, ID, US | 1 | 2018 |