Inventor

David J. Seagle

Inventor

Morgan Hill, CA, US

Overview

1996–2021

Patent span

Physics

Primary field (CPC G)

Patents· 101 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Bprimary

G11BInformation storage based on relative movement between record carrier and transducer54%

Y10TTechnical subjects covered by former us classification13%

B82YSpecific uses or applications of nanostructures12%

G01RMeasuring electric variables7%

B24BMachines, devices, or processes for grinding or polishing5%

H01LSemiconductor devices2%

H10NElectric solid-state devices not otherwise provided for2%

C25DProcesses for the electrolytic or electrophoretic production of coatings1%

H01FMagnets1%

G01NInvestigating or analysing materials by determining their chemical or physical properties1%

PatentTitleYear

11,114,117Process for manufacturing magnetic head having a servo read transducer structure with dielectric gap liner and a data read transducer structure with an embedded wear layer between thin and thick shield portions2021 11,074,930Read transducer structure having an embedded wear layer between thin and thick shield portions2021 10,997,995Electrostrictive control for the width of a tape-head-array2021 10,997,994Current-perpendicular-to-plane (CPP) read transducer structure having flux guide and pinned soft bias layer for stabilizing sensor and flux guide2021 10,957,347Thin film heating device in a write gap2021 10,902,873Apparatus with multi-channel tape head module having controllable expansion elements2021 10,832,712Magnetic thin film recording head module having electrical shielding between read and write transducer arrays2020 10,762,924Electrostrictive control for the width of a tape-head-array2020 10,720,570Magnetic sensor using spin hall effect2020 10,297,278Material for use in a TMR read gap without adversely affecting the TMR effect2019 10,199,057Independent shunting of data and servo heads to allow a single sensor deposition on tape wafers2019 9,865,286'Tape array electrical lapping guide design for small stripe TMR sensor'2018 9,786,302'Flux-guided tunneling magnetoresistive (TMR) sensor for magnetic tape with reduced likelihood of electrical shorting'2017 9,406,320'Scissor unidirectional biasing with hard bias stabilized soft bias'2016 9,378,761'System for adjusting bias of relative magnetizations of ferromagnetic layers in a magnetoresistive sensor'2016 9,275,661'Magnetic head having a CPP sensor with tunnel barrier layer and ELG material coplanar with the tunnel barrier layer'2016 9,275,665'Slider with high frequency voltage ground and low frequency DC voltage isolation'2016 9,177,588'Recessed IRMN reader process'2015 9,153,258'Scissor magnetic read sensor with novel multi-layer bias structure for uniform free layer biasing'2015 9,129,660'Transducer resistor shunt structure for low-cost probing'2015 9,095,951'Common ground for electronic lapping guides'2015 9,099,122'Scissor sensor with back edge bias structure and novel dielectric layer'2015 9,076,468'Scissor magnetic read sensor with shape enhanced soft magnetic side shield for improved stability'2015 9,053,721'Magnetic read sensor with independently extended pinned layer and seed layer'2015 8,956,200'Wafer grounding design for single pad lapping'2015 8,956,201'Correcting current crowding in row bar and vias for single pad bonding'2015 8,891,189'Disk drive with filter compensation integrated in sliders for high-bandwidth read sensors'2014 8,854,764'Multiple-sense thermo-resistive sensor for contact detection of read-write heads'2014 8,824,077'Perpendicular magnetic recording write head with ladder network compensation circuitry on slider body for write current overshoot at write current switching'2014 8,804,287'Material for use in a TMR read gap without adversely affecting the TMR effect'2014 8,797,694'Magnetic sensor having hard bias structure for optimized hard bias field and hard bias coercivity'2014 8,749,926'Scissor magnetic read head with wrap-around magnetic shield'2014 8,531,800'Magnetic write head having dual parallel capacitors for integrated transmission line compensation'2013 8,472,146'Current perpendicular magnetoresistive sensor with a dummy shield for capacitance balancing'2013 8,472,148'Self-aligned double flux guided TMR sensor'2013 8,361,541'Fabrication of magnetoresistive sensors and electronic lapping guides'2013 8,333,898'Method for manufacturing a magnetic tape head using a TMR sensor'2012 8,335,053'Integrated touch-down pad and touch-down sensor'2012 8,274,762'Methods and systems for using resistivity of sensor film in an element shunt'2012 8,270,124'Magnetic head having reduced cost electrostatic discharge shunt'2012 8,225,487'Method for confining sense current of a read transducer to an air-bearing surface(ABS) side of a free layer'2012 8,223,462'Magnetoresistive sensor design for signal noise pickup reduction for use with deep gap electrostatic discharge shunt'2012 8,169,754'Dedicated noncorrosive smear detector'2012 8,116,032'Perpendicular magnetic recording system with auxiliary coil and circuitry for fast switching of write pole magnetization'2012 8,089,295'Wafer level balanced capacitance design for magnetic heads'2012 8,081,399'Perpendicular magnetic recording write head with enhancement capacitor on slider body for write current overshoot at write current switching'2011 7,999,566'Wafer level testing'2011 7,969,687'Magnetic head with delayed connection heater shunting'2011 7,961,437'Magnetic recording head having an extended stripe height and a shortened shield height'2011 7,932,717'Test components fabricated with pseudo sensors used for determining the resistance of an MR sensor'2011 7,919,967'Verification of a fabrication process used to form read elements in magnetic heads'2011 7,882,618'Fabricating magnetic read heads with a reduced scratch exposure region'2011 7,863,911'Test device and method for measurement of tunneling magnetoresistance properties of a manufacturable wafer by the current-in-plane-tunneling technique'2011 7,855,553'Test components fabricated with large area sensors used for determining the resistance of an MR sensor'2010 7,852,072'Test-device system for independent characterization of sensor-width and sensor-stripe-height definition processes'2010 7,768,268'Verification of a ground connection fabrication process for ESD resistors in magnetic heads'2010 7,768,748'Magnetoresistive sensor with overlaid combined leads and shields'2010 7,707,707'Method for providing a temporary deep shunt on wafer structures for electrostatic discharge protection during processing'2010 7,643,250'Pad slider design for on-slider ELGs'2010 7,630,177'Tunnel MR head with closed-edge laminated free layer'2009 7,582,218'Method for merging sensor field-mill and electronic lapping guide material placement for a partial mill process and sensor formed according to the method'2009 7,574,791'Method to fabricate side shields for a magnetic sensor'2009 7,567,409'Multilayer narrow pitch tape head array'2009 7,564,110'Electrical lapping guides made from tunneling magnetoresistive (TMR) material'2009 7,545,608'Current-perpendicular-to-the-plane (CPP) magnetoresistive sensor with impedance adjustment'2009 7,535,674'Narrow pitch tape head array using an orthogonal backgap'2009 7,469,466'Method for providing a temporary, deep shunt on wafer structures for electrostatic discharge protection during processing'2008 7,450,340'Head design with overlapping coil for narrow pitch tape head'2008 7,446,977'Recording heads having electrical pads on multiple surfaces'2008 7,349,179'Write head for improved manufacturability larger write field and reduced adjacent track erasure'2008 7,307,814'Pedestal defined zero throat writer having a recessed pedestal'2007 7,292,409'Magnetic head with thin trailing pedestal layer'2007 7,248,449'Magnetoresistive read sensor with reduced effective shield-to-shield spacing'2007 7,211,339'Highly conductive lead adjoining MR stripe and extending beyond stripe height at junction'2007 7,133,253'Pole tip with sides flared at media-facing surface'2006 7,116,517'Stitched pole write element with a T-shaped pole tip portion'2006 7,108,578'System and method for manufacturing magnetic heads'2006 7,054,113'Reader/writer for magnetic memory'2006 7,035,046'System and method for minimizing thermal pole tip protrusion'2006 6,987,643'Pole structure to relieve adjacent track writing'2006 6,909,578'Method and system for reducing thermal pole tip protrusion'2005 6,873,499'Read head having high resistance soft magnetic flux guide layer for enhancing read sensor efficiency'2005 6,870,712'Inductive writer with flat top pole and pedestal defined zero throat'2005 6,798,616'Write head architecture for improved manufacturability'2004 6,754,049'Transducers for perpendicular recording with inductive cancellation at MR sensor'2004 6,751,055'Inductive transducer with reduced pole tip protrusion'2004 6,674,610'Thin film write head with universal coil design'2004 6,256,157'Method and apparatus for removing noise spikes'2001 6,223,420'Method of making a read head with high resistance soft magnetic flux guide layer for enhancing read sensor efficiency'2001 6,158,108'Method of making magnetic head with vialess lead layers from MR sensor to pads'2000 6,038,110'Dual header tape head design'2000 6,004,473'Magnetic write head having a coil with submicron pitch'1999 5,936,811'Magnetic head with vialess lead layers from MR sensor to pads'1999 5,875,080'Write head with second coil above pole having coil density less electrically connected first coil below the pole'1999 5,764,446'Magnetic head having an air bearing surface with short-resistant leads'1998 5,735,036'Lapping process for minimizing shorts and element recession at magnetic head air bearing surface'1998 5,710,510'Apparatus and method for intra process on wafer monitoring of deposited layer permeability'1998 5,655,475'Method of grinding thin-film magnetic heads using optical grinding markers'1997 5,603,156'Lapping process for minimizing shorts and element recession at magnetic head air bearing surface'1997 5,588,199'Lapping process for a single element magnetoresistive head'1996 5,579,717'Method of grinding thin-film magnetic heads using optical grinding markers'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2021Patents assigned to IBM (21)· patent assignee history

1996–2021Based in Morgan Hill, CA, US· patent location history

2001–2005Based in Santa Barbara, CA, US· patent location history

2004–2007Patents assigned to WESTERN DIGITAL FREMONT INC (13)· patent assignee history

2006–2010Patents assigned to HITACHI GLOBAL STORAGE TECH (15)· patent assignee history

2010–2012Patents assigned to HITACHI GLOBAL STORAGE TECH NL (19)· patent assignee history

2013–2019Patents assigned to HGST Netherlands BV (26)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HGST Netherlands BV	26	2013–2019
IBM	21	1996–2021
HITACHI GLOBAL STORAGE TECH NL	19	2010–2012
HITACHI GLOBAL STORAGE TECH	15	2006–2010
WESTERN DIGITAL FREMONT INC	13	2004–2007

Locations

Location	Patents	Span
Morgan Hill, California, US	99	1996–2021
Santa Barbara, California, US	2	2001–2005