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Inventor

Gi-young Jeon

Inventor
Bucheon-si, KR

Overview

3→
Patents
1994–2003
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
G01RMeasuring electric variables25%
H05KPrinted circuits25%
PatentTitleYear
6,574,107'Stacked intelligent power module package'20036,432,750'Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof'20025,291,127'Chip-lifetime testing instrument for semiconductor devices'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
1994Based in Kyungki, KR· patent location history
2002–2003Patents assigned to FAIRCHILD KR SEMICONDUCTOR LTD (2)· patent assignee history
2002–2003Based in Bucheon-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FAIRCHILD KR SEMICONDUCTOR LTD22002–2003
SAMSUNG ELECTRONICS CO LTD11994
Locations
LocationPatentsSpan
Bucheon-si, KR22002–2003
Kyungki, KR11994