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Inventor

Shijo NAGAO

Inventor
JP

Overview

2→
Patents
2022
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering20%
C23CCoating metallic material20%
G01NInvestigating or analysing materials by determining their chemical or physical properties20%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
11,454,601Substrate evaluation chip and substrate evaluation device202211,273,525Bonding material, method for producing bonding material, and method for producing bonding structure2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to UNIV OSAKA (2)· patent assignee history
2022Patents assigned to UNIV NAT CHENG KUNG (1)· patent assignee history
2022Patents assigned to YAMATO SCIENT CO LTD (1)· patent assignee history
2022Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNIV OSAKA22022
UNIV NAT CHENG KUNG12022
YAMATO SCIENT CO LTD12022
Locations
LocationPatentsSpan
JP22022