Inventor
Tokio Isogai
Inventor
Fujisawa, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
H01GCapacitors8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
C04BLime, magnesia6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
H05KPrinted circuits6%
C03CChemical composition of glasses, glazes or vitreous enamels4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
PatentTitleYear
4,643,913'Process for producing solar cells'19874,638,443'Gas detecting apparatus'19874,586,143'Gas detecting apparatus'19864,565,767'Light-sensitive polymer composition with poly(amic acid), bisazide, and tertiary amine compound'19864,513,132'Heat-resistant silicone block polymer'19854,486,232'Electrode material for semi-conductor devices'19844,457,161'Gas detection device and method for detecting gas'19844,451,551'Radiation-sensitive poly(amic acid) polymer composition'19844,419,506'Radiation sensitive polymer materials'19834,386,387'Low temperature sintering porcelain composition'19834,369,208'Process for producing transparent electroconductive film'19834,347,304'Process for forming metallic image'19824,347,166'Thermistor composition'19824,324,629'Process for regenerating chemical copper plating solution'19824,321,319'Photosensitive compositions containing polyamides acid with photosensitive groups'19824,310,563'Method for automatically controlling composition of chemical copper plating solution'19824,308,571'Low temperature-sinterable dielectric composition and thick film capacitor using the same'19814,303,443'Electroless copper plating solution'19814,303,554'Composition and process for producing transparent conductive film'19814,220,547'Dielectric paste for thick film capacitor'19804,208,005'Method for mounting parts on circuit boards'19804,145,369'Flame-retardant epoxy resin compositions'1979Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1979–1987Patents assigned to HITACHI LTD (21)· patent assignee history
1979–1987Based in Hitachi, JP· patent location history
1980–1986Based in Fujisawa, JP· patent location history
1983–1986Patents assigned to HITACHI CHEMICAL CO LTD (4)· patent assignee history
1984–1987Based in Katsuta, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 21 | 1979–1987 |
| HITACHI CHEMICAL CO LTD | 4 | 1983–1986 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fujisawa, JP | 17 | 1980–1986 |
| Katsuta, JP | 3 | 1984–1987 |
| Hitachi, JP | 2 | 1979–1987 |