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Inventor

Joel Ong

Inventor
San Francisco, CA, US

Overview

4→
Patents
2013–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics38%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering38%
B01DSeparation13%
H04MTelephonic communication13%
PatentTitleYear
11,123,919Method for build separation from a curing interface in an additive manufacturing process202111,123,918Method for build separation from a curing interface in an additive manufacturing process202111,104,075System for window separation in an additive manufacturing process20218,462,670'Internet based communication system and method'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013Patents assigned to CHIEN MING LIANG (1)· patent assignee history
2013Patents assigned to HOIIO PTE LTD (1)· patent assignee history
2013Patents assigned to KOK YEW MENG (1)· patent assignee history
2013Based in Singapore, SG· patent location history
2021Patents assigned to ORIGIN LABORATORIES INC (3)· patent assignee history
2021Patents assigned to STRATASYS INC (3)· patent assignee history
2021Based in San Francisco, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ORIGIN LABORATORIES INC32021
STRATASYS INC32021
CHIEN MING LIANG12013
HOIIO PTE LTD12013
KOK YEW MENG12013
Locations
LocationPatentsSpan
San Francisco, California, US32021
Singapore, SG12013